Cohu Secures Fourth HPC Customer for Eclipse Semiconductor Test Platform, Expanding AI Chip Testing in Asia
An unnamed fabless semiconductor company has selected Cohu’s Eclipse platform for high-volume testing of next-generation HPC devices at an Asian OSAT facility. The system combines precision thermal control with PAICe software analytics to improve testing productivity, supporting a market opportunity Cohu estimates at approximately US$1 billion annually.
Cohu, Inc. (NASDAQ: COHU), a global supplier of equipment and services optimizing semiconductor manufacturing yield and productivity, announced that a new fabless semiconductor customer has selected Cohu’s Eclipse platform for production testing of its next-generation high-performance computing (HPC) devices. The Eclipse ships with PAICe® Prescriptive software analytics tool that continuously analyzes equipment signals and behavior patterns to improve productivity. The devices will be tested at a high-volume manufacturing facility in Asia operated by a global outsourced semiconductor assembly and test (OSAT) provider.
This marks the fourth customer to qualify Cohu's Eclipse platform for HPC applications. The systems will be deployed in volume manufacturing to support final test operations requiring precise and uniform thermal control, and production-proven reliability. This milestone demonstrates further execution of Cohu's HPC opportunity pipeline, which the company estimates represents approximately $1 billion in annual sales opportunities.
“This production win further validates Eclipse as a leading handler platform for advanced HPC applications,” said Luis Müller, Cohu President and CEO. “As semiconductor devices continue to increase in complexity and performance requirements, customers need test solutions that deliver exceptional thermal performance, productivity, and reliability. Eclipse is designed to meet these demanding requirements while enabling efficient, high-volume manufacturing.”
The Eclipse platform is a field-upgradable solution engineered to meet the stringent test requirements of HPC and AI datacenter devices, including GPUs, CPUs, custom AI accelerators, Network Processors and ASICs, by delivering precise dynamic thermal control, broad test coverage and handling capabilities for large devices, delivering high test yield on a configurable future proof production platform.
