Global Semiconductor Wafer Polishing and Grinding Equipment Market to Reach USD 890.6 Million by 2032

The "Semiconductor Wafer Polishing & Grinding Equipment Market - Global Forecast 2025-2032" report has been added to ResearchAndMarkets.com's offering.

The Semiconductor Wafer Polishing & Grinding Equipment Market grew from USD 582.82 million in 2024 to USD 612.25 million in 2025. It is expected to continue its upward trajectory at a CAGR of 5.44%, ultimately reaching USD 890.64 million by 2032. This strong performance reflects increasing demand for advanced substrate preparation and precision-finishing solutions required by high-performance logic and memory device production across global regions.

Scope & Segmentation

This research provides in-depth analysis and forecasts for the semiconductor wafer polishing and grinding equipment sector, encompassing the following dimensions:

Equipment Type: Grinding equipment; polishing equipment
Wafer Size: 200 mm wafers; 300 mm wafers; 450 mm wafers
Application: Logic (ASICs, FPGAs, microprocessors); memory (DRAM, flash memory, Optane)
End-user: Foundries; integrated device manufacturers; memory manufacturers
Geographies Covered: Americas (United States, Canada, Mexico, Brazil, Argentina, Chile, Colombia, Peru); Europe, Middle East, and Africa (United Kingdom, Germany, France, Russia, Italy, Spain, Netherlands, Sweden, Poland, Switzerland, United Arab Emirates, Saudi Arabia, Qatar, Turkey, Israel, South Africa, Nigeria, Egypt, Kenya); Asia-Pacific (China, India, Japan, Australia, South Korea, Indonesia, Thailand, Malaysia, Singapore, Taiwan)
Key Takeaways for Senior Decision-Makers

Market growth is being shaped by advances in wafer surface conditioning technologies, notably the integration of real-time sensor arrays and process automation.
Regional specialization drives innovation, with the Americas emphasizing advanced logic nodes, EMEA advancing sustainable processing, and Asia-Pacific leading in manufacturing scale and service speed.
Sustainable manufacturing practices are gaining traction, with the adoption of eco-friendly consumables and water-recycling modules supporting both regulatory and operational goals.
Equipment suppliers are leveraging digital tools, such as digital twin simulations and predictive maintenance, to boost yield and optimize process control.
Collaborations among OEMs, chemical suppliers, and major foundries are fostering rapid, application-specific toolset development and strengthening supplier-customer integration.
Service excellence through global field support networks and rapid spare distribution is increasingly a competitive differentiator in customer acquisition and retention strategies.
Why This Report Matters

Enables informed capital allocation and supply chain configuration by highlighting distinct equipment, wafer size, and regional strategy requirements.
Empowers leadership to anticipate and navigate regulatory disruptions, such as tariffs, and leverage sustainable technologies for long-term operational resilience.
Delivers actionable insights for senior stakeholders seeking to optimize competitive strategy, accelerate qualification cycles, and drive yield improvements.

Market Insights

AI-driven predictive maintenance algorithms reducing downtime in wafer polishing and grinding equipment
Real-time in-situ metrology integration enabling sub-nanometer planarization precision in CMP processes
Sustainable slurry recycling systems minimizing chemical waste and operational costs in wafer polishing
Adoption of diamond abrasive technologies enhancing removal rates and surface quality for advanced nodes
Industry 4.0 automation platforms enabling closed-loop control and remote monitoring of wafer grinding operations
Advanced thin-wafer handling solutions preventing breakage during ultra-thin substrate grinding and polishing
Collaborative robotic tooling for automated maintenance and tool changeover in semiconductor wafer processing
The companies profiled in this Semiconductor Wafer Polishing & Grinding Equipment market report include:

3M Company
Applied Materials, Inc.
Arnold Gruppe
ATM Qness GmbH
Buehler Ltd.
Chichibu Denshi, Inc.
DIsco Corporation
Ebara Corporation
Engis Corporation
Entegris, Inc.
Evatec AG
Fujikoshi Machinery Corp.
Hitachi High-Technologies Corporation
Hunan Yujing Machinery Co., Ltd.
KEHREN GmbH
KLA Corporation
Kulicke and Soffa Industries, Inc.
Lapmaster Wolters Ltd.
MCF TECHNOLOGIES LTD.
PHOTON EXPORT THIN FILMS & PATENTS SL
Revasum Inc.
Tokyo Electron Limited