Nordic Semiconductor Demonstrates Bluetooth High Data Throughput Technology for Faster Low-Power Wireless Connectivity
The company has demonstrated Bluetooth HDT support in silicon, enabling faster data transfers and longer packets while maintaining Bluetooth Low Energy efficiency. The technology is expected to support wearables, smart home devices, hearing aids and PC accessories, with the Bluetooth standard targeted for release in late 2026.
Nordic Semiconductor (OSE: NOD), a global leader in low-power wireless connectivity solutions, proves the upcoming Bluetooth® High Data Throughput (HDT) feature in silicon through its video demonstration. Nordic, who has an established reputation as a leader in Bluetooth technology, is one of the first vendors to showcase support for Bluetooth HDT.
With support for longer packets, Bluetooth HDT will let wearables, smart home devices, PC accessories, hearing aids, and other Bluetooth Low Energy (LE) products transfer data significantly faster, while retaining Bluetooth LE's energy efficiency.
Built on the Bluetooth LE billions of devices already use
Nordic will bring Bluetooth HDT to developers through the standard software, tools, and developer experience used by customers today. That means product designers can add faster data transfer without starting over on a new stack, new tools, or with a new supplier.
A step up in Bluetooth LE capability
Bluetooth HDT is expected to be released in late 2026 by the Bluetooth Special Interest Group (SIG). It will introduce new ways for the radio to pack more data into each transmission, along with support for longer packets enabling higher bandwidth Bluetooth data transfer.
