Nordson SonoFlex Wins 2026 Best of West Award for Advanced Semiconductor Inspection

Nordson Test & Inspection has won the 2026 Best of West Award at SEMICON West for its SonoFlex Acoustic System, an automated inspection platform designed to improve defect identification and production throughput in small panel-based semiconductor assemblies.

The award was announced on 15 October 2026 by SEMI and Semiconductor Digest during SEMICON West 2026, held at the Moscone Center in San Francisco from 13 to 15 October.

Presented annually by SEMI Americas and Semiconductor Digest, the award recognises products and services that deliver significant improvements in semiconductor and electronics manufacturing technologies.

Nordson's SonoFlex was selected for its combination of high-speed acoustic inspection, improved defect detection sensitivity and modular equipment architecture.

SonoFlex Doubles Acoustic Inspection Speed

The SonoFlex platform is designed to address inspection requirements in advanced semiconductor packaging, where identifying internal defects without damaging components is essential for maintaining manufacturing quality.

According to Nordson, the system can inspect small panel-based assemblies at twice the scanning speed of conventional equipment, using advanced pulser and transducer technologies.

The platform also supports acoustic inspection across what the company describes as the broadest frequency range achieved in a production environment.

Its inspection technology enables manufacturers to examine internal structures and identify potential defects that may not be visible through conventional surface inspection methods.

Faster scanning could help semiconductor manufacturers reduce inspection bottlenecks while maintaining the sensitivity required to assess increasingly complex packaged devices.

FlexCore Software Improves Defect Identification

A major feature of the SonoFlex system is its newly developed FlexCore software, which incorporates advanced acoustic signal processing and imaging capabilities.

The software works with Nordson Intelligence Multi Gate Image Analysis (MGIA) to identify defects and distinguish genuine internal voids from other features appearing in acoustic images.

This capability is intended to improve the accuracy of defect assessment and reduce the need for manual interpretation during inspection.

SonoFlex also incorporates ThruScan imaging technology, which uses acoustic signals to examine internal features within semiconductor assemblies.

The imaging system is designed to provide greater visibility into complex device structures, helping manufacturers investigate defects and assess process quality without destructive testing.

By combining automated inspection with advanced image analysis, Nordson aims to support more consistent defect identification across semiconductor packaging operations.

Modular Architecture Increases Inspection Throughput Eightfold

Nordson has developed SonoFlex with a modular architecture that allows multiple inspection systems to operate together.

Up to four SonoFlex systems can be configured to work in parallel, increasing the number of units inspected per hour.

According to the company, this configuration can improve overall inspection throughput by as much as eight times, compared with its reference legacy equipment configuration.

The modular approach also allows manufacturers to expand inspection capacity as production requirements increase rather than relying on a single fixed system configuration.

Individual modules can be replaced or serviced, potentially simplifying maintenance and reducing interruptions to manufacturing operations.

These features are particularly relevant for semiconductor packaging facilities seeking to increase production volumes while maintaining consistent inspection standards.

Best of West Award Recognises Semiconductor Manufacturing Advances

The 2026 Best of West competition evaluated technologies intended to improve electronics manufacturing performance, efficiency and production capabilities.

Nordson was selected from a group of finalists that also included Edwards, part of the Atlas Copco Group, and Siemens Industry.

Edwards was recognised for its Ganymede dry vacuum pump, while Siemens was shortlisted for its Eigen Engineering Agent, a software platform designed to support industrial engineering and automation activities.

Pete Singer, Editor-in-Chief of Semiconductor Digest, said SonoFlex stood out for bringing together higher inspection speeds, improved sensitivity and modular capabilities for small panel-based assemblies.

The award was presented at Nordson Test & Inspection's exhibition stand during SEMICON West 2026.

Advanced Packaging Drives Demand for Better Inspection

The development of SonoFlex comes as advanced semiconductor packaging processes place greater demands on inspection and quality control equipment.

As manufacturers integrate more semiconductor dies, interconnects and complex packaging structures into individual devices, identifying internal defects becomes increasingly important for maintaining production yields and long-term reliability.

Acoustic microscopy provides a non-destructive method of examining internal structures, including potential voids, delamination and other defects that could affect package performance.

Higher inspection throughput is also becoming important as packaging manufacturers increase production to support AI processors, high-performance computing systems and other semiconductor applications.

For semiconductor assembly and testing companies, particularly those operating across Asia's major packaging hubs, equipment that combines faster scanning with reliable defect identification could help address growing inspection requirements.

Nordson's latest system reflects a wider industry focus on improving semiconductor manufacturing efficiency through automated inspection, advanced imaging and modular equipment designs.

The commercial significance of SonoFlex will ultimately depend on its performance in production environments, including defect detection accuracy, equipment utilisation and the ability to deliver consistent throughput across different semiconductor package designs.