South Korean semiconductor equipment maker Hanmi Semiconductor has secured a KRW 7.87 billion (approximately US$5.8 million) order from UTAC Thailand, the Thai subsidiary of Singapore-based semiconductor packaging and testing company UTAC. The order covers Hanmi Semiconductor’s micro SAW & VISION PLACEMENT (MSVP) equipment and is scheduled to run until 28 December 2026. The value of the latest contract is equivalent to around 1.37% of Hanmi Semiconductor’s consolidated revenue for 2025.
The MSVP is designed as a semiconductor back-end processing system, bringing several production stages together within a single equipment platform. Its functions include package cutting, cleaning, drying, inspection, sorting and loading. The system can support the manufacturing of a range of semiconductor products, including DRAM, NAND flash and high-bandwidth memory (HBM), as well as system semiconductors. Its capabilities also extend to applications involving printed circuit boards and glass substrates.
The order highlights continued demand for semiconductor back-end equipment as manufacturers expand capacity across memory and system semiconductor applications. As chip packages become more complex and production requirements increase, equipment that can integrate multiple handling and processing stages can play an important role in improving manufacturing workflows.
UTAC provides semiconductor assembly, packaging and testing services to a broad customer base that includes fabless semiconductor companies, integrated device manufacturers and foundries. Its operations cover the back-end stages of semiconductor production, making equipment suppliers such as Hanmi Semiconductor an important part of its manufacturing infrastructure.
The latest agreement also builds on an existing business relationship between the two companies. Hanmi Semiconductor previously supplied semiconductor manufacturing equipment worth approximately KRW 1.56 billion to UTAC Thailand in May 2022. The new order therefore represents a further expansion of their cooperation and gives Hanmi Semiconductor an additional opportunity to supply equipment to UTAC’s operations in Thailand.
With the new contract, Hanmi Semiconductor is continuing to expand its presence in the semiconductor back-end equipment market. The company’s MSVP platform, which is designed to handle multiple stages of semiconductor package processing and inspection, is positioned for use across memory, system semiconductor and substrate-related manufacturing applications. The latest order from UTAC Thailand adds to the company’s international customer base and reflects ongoing investment in semiconductor production and packaging capacity.