Hanmi Semiconductor Ships First FC Bonder 75 to Expand AI Advanced Packaging Portfolio
The 2.5D packaging system handles packages up to 75mm by 75mm, enabling larger multi-chip designs integrating processors and HBM while broadening Hanmi’s equipment offering beyond conventional HBM bonding.
South Korean semiconductor equipment manufacturer Hanmi Semiconductor has shipped its first FC Bonder 75 system to a global customer, marking a move into advanced packaging equipment for AI system semiconductors. The company has traditionally been known for its thermal compression (TC) bonding equipment used in high-bandwidth memory (HBM) production, while the new system broadens its focus towards 2.5D packaging applications for high-performance AI chips.
The FC Bonder 75 has been developed to support large-scale 2.5D packaging, with the ability to process packages measuring up to 75mm by 75mm. This is substantially larger than conventional semiconductor packages, which are typically around 20mm by 20mm. The larger format allows manufacturers to integrate bigger dies and multiple semiconductor components within a single package, an increasingly important requirement as AI processors become more powerful and complex.
2.5D packaging brings together different semiconductor components, such as CPUs, GPUs and HBM, using an interposer to create a high-performance multi-chip package. As AI applications continue to drive demand for greater computing capacity, chipmakers are increasingly adopting advanced packaging approaches to connect multiple processing and memory components while maintaining high-speed data transfer. The resulting growth in interposer and substrate sizes is also creating demand for packaging equipment capable of handling significantly larger packages.
Hanmi Semiconductor is expanding its product portfolio in response to this shift. During 2026, the company introduced the FC Bonder 3.5, along with the 2.5D TC Bonder 40 C2S and 2.5D TC Bonder 40 C2W. It is also preparing the 2.5D TC Bonder 120, further extending its range of equipment for advanced AI semiconductor packaging. The company's portfolio is intended to address different requirements across chip-on-wafer and wafer-on-substrate processes.
The company is also preparing to strengthen its presence in the US market through the planned establishment of Hanmi USA in October. The subsidiary is expected to help Hanmi Semiconductor engage more closely with AI-focused technology companies, foundries, outsourced semiconductor assembly and test (OSAT) providers and memory manufacturers in the region. The company anticipates growing demand for advanced packaging equipment as US-based semiconductor operations expand in the coming years.
The shipment of the FC Bonder 75 therefore represents an expansion of Hanmi Semiconductor's business beyond HBM-related equipment and into the wider AI system semiconductor packaging market. By adding larger-format 2.5D bonding systems to its portfolio, the company is seeking to respond to changing packaging requirements as AI processors increasingly combine multiple chips and memory technologies within a single package.
