• Friday | 09 October 2026
Wolfspeed Secures Conditional $1.5 Billion US Commitment for Domestic SiC Production

Wolfspeed has received a conditional commitment for up to $1.5 billion in long-term financing from the US Department of War through its Office of Strategic Capital, as the company looks to strengthen domestic production of silicon carbide and other wide-bandgap semiconductor technologies. The proposed financing carries a 30-year term and is intended to support the development and manufacture of s...

9 Oct 2026 | Friday | NEWS
The 10 Stories That Defined Semiconductors in 2026 So Far, and What the Market Got Wrong

Semiconductor headlines in 2026 have been unusually large. AI accelerator demand kept climbing. Memory prices surged. Washington rewrote parts of its China chip policy. Beijing's domestic AI hardware push gathered pace. India committed another ₹1,27,500 crore to semiconductors through Semicon 2.0, and Japan kept putting public and private capital behind Rapidus. The market numbers make the exci...

9 Oct 2026 | Friday | Analysis
EMD Electronics Opens New Wisconsin R&D Facility to Advance Semiconductor Materials

Part of $200 million multi-year investment strengthening the company's U.S. Electronics footprint, enabling further growth for the industry New 38,000-square-foot Sheboygan Falls, Wisconsin facility expands R&D capabilities for advanced materials critical to next-generation chip manufacturing Dedicated synthesis, scale-up, and technology transfer capabilities are designed to shorten the ...

8 Oct 2026 | Thursday | NEWS
Qnity Launches Kalrez 7080 Sealing Solution for High-Temperature Semiconductor Processes

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, introduced Kalrez® 7080 perfluoroelastomer parts, a high-performance sealing solution engineered for semiconductor processes operating at temperatures up to 330°C. Designed to support increasingly demanding thermal environments, the new solution strengthens Q...

7 Oct 2026 | Wednesday | NEWS
MICROIP and AQLS Expand North American Opportunities in Edge AI, Drones and Custom Silicon

MICROIP Inc. (TPEx: 7796) and its group company, AQLS Inc., generated strong commercial traction across defense, healthcare and energy sectors during Taiwan Expo USA 2026 in Dallas. The group engaged with over 100 North American and international organizations, while U.S. state and local government officials explored local operations. Following MICROIP's recent APAC automotive wins and a 20 millio...

6 Oct 2026 | Tuesday | NEWS
MIPS and Xcelsa Labs Partner to Speed Custom Silicon Development with AI Design Optimisation

Accelerating the path to custom silicon: MIPS processor IP and Xcelsa’s Apex platform help customers move from software and workload requirements to formally verified, differentiated silicon faster. Optimizing hardware for demanding workloads: The collaboration combines MIPS’ software-first, workload-focused platforms with AI-driven design optimization to improve performance, powe...

30 Sep 2026 | Wednesday | NEWS
Efinix Launches Sapphire RV64 SoC for Embedded Linux and Edge AI Applications

Efinix® Inc., the FPGA company accelerating edge AI innovation, announced the Sapphire™ RV64 SoC, a 64-bit RISC-V processor core that expands the company's Sapphire SoC suite and gives embedded designers a high performance, configurable processor platform in a small, low power footprint. Built on the RISC-V Instruction Set Architecture (ISA), Sapphire RV64 is designed for customers whose...

30 Sep 2026 | Wednesday | NEWS
SEMIFIVE Signs $52 Million AI Inference Accelerator Development Contract in North America

SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced that it has signed a contract worth approximately KRW 70.3 billion (USD 52 million) with a U.S.-based AI fabless company to develop a next-generation AI inference accelerator. The project marks SEMIFIVE's first "Spec Hand-off" engagement in the North American market. The contract alone represents more than ...

30 Sep 2026 | Wednesday | NEWS
SUNON Showcases Liquid Cooling Solutions for AI Datacentres

As AI computing continues to advance at an unprecedented pace, rising chip power densities and increasing thermal loads in data centers are creating new challenges for thermal management. Liquid cooling is rapidly becoming a critical technology for supporting the next generation of AI infrastructure. At the 2026 OCP Global Summit, SUNON will showcase its latest liquid cooling innovations under th...

30 Sep 2026 | Wednesday | NEWS
POLYN Advances VibroSense TMS Chip for Real-Time Tyre-Road Friction Detection

POLYN Technology, developer of innovative application-specific neuromorphic analogue signal-processing (NASP™) chips, announced a major milestone in the rollout of its VibroSense TMS solution, which tests have already shown enhances vehicle safety through improved braking. The VibroSense TMS engineering chip, the integrated circuit for tire-road friction detection, is being delivered for as...

29 Sep 2026 | Tuesday | NEWS
ACCM Expands US Manufacturing Capacity for Celeritas Materials Supporting AI Hardware

Advanced Chip and Circuit Materials, Inc. (ACCM) announced a major expansion of its US manufacturing capacity for the Celeritas® family of advanced dielectric materials, covering the four segments of AI hardware where material supply and performance currently constrain system design: ultra-high-speed skew-free materials, low- and negative-expansion laminates for large accelerator boards, IC su...

28 Sep 2026 | Monday | NEWS
GSME and Teradyne Partner to Accelerate Semiconductor Test and Production Readiness

GS Microelectronics U.S., Inc. (GSME), a fast-growing semiconductor solutions provider, and Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, announced a multi‑year strategic partnership to establish a state‑of‑the‑art semiconductor test and evaluation center designed to accelerate customer time‑to‑market. The collaboration integra...

24 Sep 2026 | Thursday | NEWS
STARTRADER Launches 24/7 CFDs Referencing CXMT and Unitree Robotics

STARTRADER announced the launch of two new 24/7 CFD instruments: CXMTUSD (CXMT Corporation) and UNITREEUSD (Unitree Robotics), available Monday through Sunday, 00:00–24:00 (GMT+3 platform time), subject to scheduled maintenance windows. Both instruments are USD-denominated CFDs referencing Shanghai-listed companies. The AI story has focused largely on software, while the hardware behind it ...

23 Sep 2026 | Wednesday | NEWS
EFC Gases Breaks Ground on Advanced Materials Facility in Texas

EFC Gases & Advanced Materials ("EFC"), a leading global supplier of speciality gases and advanced materials, celebrated the groundbreaking of its new advanced manufacturing facility in McGregor, Texas, on September 15, 2026. The project represents a significant investment in expanding domestic production of high-purity materials critical to semiconductor manufacturing and strengthening the U....

23 Sep 2026 | Wednesday | NEWS
MetaOptics Secures US$10 Million Facility to Scale Metalens Manufacturing in the US

MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group"), a leading-edge semiconductor optics company pioneering metalens technology, announced that it has secured an investment facility of up to US$10 million from White Lion Capital LLC ("White Lion"), pursuant to a warrant deed entered into with White Lion, under which the Company may, ...

22 Sep 2026 | Tuesday | NEWS
SEMICON India 2026 to Bring Together Global Semiconductor Ecosystem in New Delhi

New Delhi is set to host SEMICON India 2026 from 17–19 September, with Prime Minister Narendra Modi scheduled to inaugurate the three-day conference and exhibition at Yashobhoomi on 17 September. Organised around the theme ‘Silicon to Systems: Building the Ecosystem’, the event will bring together global and Indian semiconductor companies, policymakers, investors, researchers, s...

17 Sep 2026 | Thursday | NEWS
Anderon Secures $1 Billion CHIPS Award to Advance Quantum Wafer Manufacturing

Anderon LLC ("Anderon"), an IBM (NYSE: IBM) company, announced the finalisation of a $1 billion award under the CHIPS and Science Act with the U.S. Department of Commerce (the "Department"). The award will accelerate Anderon's R&D efforts to advance the nation's quantum wafer manufacturing capabilities. Announced in May under a letter of intent between the Department and IBM, Anderon operates...

17 Sep 2026 | Thursday | NEWS
JETRO and Purdue University Partner to Strengthen Japan-US Advanced Technology Innovation

The Japan External Trade Organisation (JETRO) and Purdue University announced the signing of a Memorandum of Understanding (MOU) to strengthen innovation collaboration in advanced technology fields and further connect the innovation ecosystems of Japan and the United States. The MOU was signed by Norihiko Ishiguro, Chairman and CEO of JETRO, and Mitchell E. Daniels, Jr., President of Purdue ...

11 Sep 2026 | Friday | NEWS
Axcelis Invests $35 Million in New Ion Implantation Facility in South Korea

Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced plans to invest $35 million in its global manufacturing infrastructure through the construction of a new ion implantation equipment manufacturing facility in Pyeongtaek, Gyeonggi Province, Korea. President and CEO Russell Low commented, "This investme...

11 Sep 2026 | Friday | NEWS
PsiQuantum Secures $100 Million US CHIPS Funding to Advance Quantum Computing Manufacturing

PsiQuantum announced that the company has signed definitive documentation with the U.S. Department of Commerce for a $100 million award to strengthen American leadership in quantum computing and semiconductor supply-chain security. In May 2026, the company announced that it had signed a letter of intent with the Department for $100 million in proposed federal research and development (R&...

10 Sep 2026 | Thursday | NEWS

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