• Friday | 23 October 2026
Rapidus Launches CORE Ecosystem to Support Advanced Semiconductor Design and Manufacturing

Rapidus Corporation announced that it will establish the Rapidus Collaborative Open Rapid Ecosystem (CORE), a global ecosystem framework to support the development and mass production of cutting-edge semiconductors. Today, semiconductor development requires more than just manufacturing technology; it is essential to integrate the entire semiconductor value chain —including research ins...

6 Oct 2026 | Tuesday | NEWS
MICROIP and AQLS Expand North American Opportunities in Edge AI, Drones and Custom Silicon

MICROIP Inc. (TPEx: 7796) and its group company, AQLS Inc., generated strong commercial traction across defense, healthcare and energy sectors during Taiwan Expo USA 2026 in Dallas. The group engaged with over 100 North American and international organizations, while U.S. state and local government officials explored local operations. Following MICROIP's recent APAC automotive wins and a 20 millio...

6 Oct 2026 | Tuesday | NEWS
OMNIVISION Launches 5MP Global Shutter HDR Image Sensor for Machine Vision and Robotics

OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging, analog, and display technology, announced the industry’s first 2.2-micron (µm) 5-megapixel (MP) global shutter (GS) high dynamic range (HDR) CMOS image sensor that is purpose-built for industrial machine vision applications, such as barcode scanners, factory automation, compact AI cam...

6 Oct 2026 | Tuesday | NEWS
Magnachip Expands Power Semiconductor Portfolio with 15 Gen6 Super-Junction MOSFETs

Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) announced the expansion of its power semiconductor portfolio with 15 new sixth-generation (Gen6) E6 super-junction (SJ) MOSFETs for consumer and computing power applications. As consumer and computing systems deliver higher performance in increasingly compact form factors, power designers need to manage efficiency, thermal pe...

6 Oct 2026 | Tuesday | NEWS
E&R Engineering Expands Semiconductor Packaging Operations with New Malaysia Facility

E&R Engineering Corp., (TWSE: 8027) an international provider of semiconductor packaging equipment, announced the upcoming grand opening of its new Malaysian subsidiary—E&R SEMICONDUCTOR (MALAYSIA) SDN. To meet surging Southeast Asian demand, E&R Engineering is upgrading its global strategy for the packaging materials business unit. While its plant in China continues to experien...

6 Oct 2026 | Tuesday | NEWS
VIS Considers Second Singapore Semiconductor Fab as AI Infrastructure Demand Grows

Vanguard International Semiconductor (VIS) is considering a second semiconductor manufacturing facility in Singapore as strong demand linked to AI infrastructure has already filled the initial capacity of its newly opened plant. The company’s Singapore operation, VisionPower Semiconductor Manufacturing Company (VSMC), is a joint venture between VIS and NXP Semiconductors. Its first 300mm wa...

5 Oct 2026 | Monday | NEWS
GIGABYTE Expands AI TOP ATOM Desktop Platform with 64GB Unified Memory

GIGABYTE announced the launch of a new 64GB unified memory version of GIGABYTE AI TOP ATOM, expanding its existing 128GB offering. Available starting October 23, the new configuration retains the hardware design of AI TOP ATOM, based on the NVIDIA DGX Spark platform, giving developers, researchers, and enterprise teams greater flexibility to select the configuration that best fits their AI workloa...

5 Oct 2026 | Monday | NEWS
MetaOptics Expands into Malaysia with Penang Metalens Manufacturing Platform

MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group"), a leading-edge semiconductor optics company, announced the incorporation of its wholly-owned Malaysian subsidiary, MetaOptics Technologies Sdn. Bhd. The incorporation affirms the Group's commitment to advancing next-generation optical technologies and strengthening cross-border collabor...

5 Oct 2026 | Monday | NEWS
Hamamatsu Photonics Launches iPHEMOS-DDX for Advanced Semiconductor Package Failure Analysis

Hamamatsu Photonics has developed the iPHEMOS®-DDX, an inverted emission microscope designed for failure analysis of advanced semiconductor packages, including AI chiplets, High Bandwidth Memory (HBM), 2.5D/3D packages, and large-scale semiconductor packages. The semiconductor industry is rapidly advancing with the growth of generative AI, driving increased performance in AI chips while makin...

5 Oct 2026 | Monday | NEWS
Cervoz Launches T449 and T459 Industrial NVMe SSDs for Rugged Embedded Systems

Cervoz Technology, a leading provider of industrial storage, memory, and expansion module solutions, announced the launch of its T449 and T459 Series, a new line of MIL-STD-810H compliant M.2 2280 NVMe SSDs engineered for embedded systems deployed in defense, aerospace, transportation, and industrial automation. Environmental Reliability Harsh environments place continuous mechanical and environ...

5 Oct 2026 | Monday | NEWS
Volantis Raises $88 Million to Develop Photonic Memory Architecture for AI Inference

Volantis, a semiconductor company building a new category of AI inference system, announced an $88 million Series A co-led by Lachy Groom and Abstract Ventures, with participation from John Doerr, VXI Capital, Triatomic and Susa Ventures. The round also includes angel investors Dwarkesh Patel, Naveen Rao and Sholto Douglas. Volantis is building a new AI inference architecture that eliminates the ...

5 Oct 2026 | Monday | NEWS
The Package Is the New Processor: Why Chiplets Are Rewriting Semiconductor Design

For most of the industry’s history, progress meant one thing: pack more functions onto a single piece of silicon. That playbook still works for plenty of products. But at the frontier, in AI accelerators, data-centre processors and high-end networking, it is running into hard limits of physics, yield and cost. The response is a quiet but fundamental change in how chips are conceived. Instead...

2 Oct 2026 | Friday | Analysis
SINTRONES to Showcase Edge AI Computing Platforms for Semiconductor Inspection at VISION 2026

SINTRONES Technology (TPEx: 6680), a global provider of rugged industrial and edge AI computing solutions, will showcase edge AI computing platforms for machine vision, automated optical inspection (AOI), and semiconductor inspection at VISION 2026, Hall 8, Booth 8D14, Messe Stuttgart, October 6–8. From high-density GPU systems to compact edge AI platforms, SINTRONES provides scalable compu...

2 Oct 2026 | Friday | NEWS
SEMIFIVE and Mobilint Partner to Develop Custom AI Chip for Robotics

Accelerates commercialisation of robotics AI chip through end-to-end "Spec Hand-off" development Integrates next-generation memory and interface technologies, including LPDDR6, PCIe Gen6 and UCIe-S Expands applications beyond data centre, HPC and edge AI into Physical AI, diversifying business portfolio SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announc...

2 Oct 2026 | Friday | NEWS
World Manufacturing Convention 2026 Secures $54.2 Billion in Project Agreements

The 2026 World Manufacturing Convention concluded with 790 project agreements representing RMB 363.4 billion (approximately US$54.2 billion), organisers announced at a Sept. 29 Anhui briefing. Held Sept. 20–23 under the theme "Intelligent Manufacturing for a Better Future," it featured keynote addresses, business matchmaking, research and data releases, and exhibitions. Guests and exhibito...

2 Oct 2026 | Friday | NEWS
Synopsys and OpenAI Partner to Develop GPT-Synopsys for Semiconductor Design

Synopsys (Nasdaq: SNPS) and OpenAI announced a strategic partnership that brings together OpenAI's advanced AI capabilities with Synopsys' industry-leading EDA tools and agentic AI capabilities to revolutionise the design of semiconductors. The companies signed an expansive, multi-year agreement to jointly develop GPT-Synopsys, a specialised model, optimised to use Synopsys EDA tools to perform se...

2 Oct 2026 | Friday | NEWS
Toshiba Launches Low-Power Dual-Channel Digital Isolators for Industrial Equipment

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched four dual-channel standard digital isolators for industrial equipment, the “DCL32xx00 Series.” The new products achieve low current consumption of 0.2mA per channel[1] (typ.), support mid-speed communications[2], and feature an SOIC8-N package. Volume shipments start today. The lineup includes "DCL320C00" an...

2 Oct 2026 | Friday | NEWS
AI Moves Deeper into Semiconductor Design as Chipmakers Automate More Development Tasks

Artificial intelligence is becoming increasingly involved in semiconductor development, moving beyond individual optimisation tasks to support wider parts of the chip-design process. Electronic design automation (EDA) companies have already introduced machine-learning and reinforcement-learning tools for areas such as floorplanning, placement, routing and power, performance and area (PPA) optimisa...

1 Oct 2026 | Thursday | NEWS
Intel Patents Glass Substrate Packaging with Embedded MicroLEDs for Advanced Chip Connectivity

Intel has secured a US patent describing a chip-packaging approach that places MicroLEDs directly within a glass substrate, potentially opening another route towards optical connectivity inside advanced semiconductor packages. The design embeds semiconductor dies equipped with MicroLEDs into glass and uses through-glass vias (TGVs) to provide the required power and signal connections. The LEDs can...

1 Oct 2026 | Thursday | NEWS
Renesas Launches 650V GaN Device with Dual-Side Cooling for 800V AI Datacentres

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, launched the industry's first 650V GaN device with dual-side cooling for high-density power conversion in 800V high-voltage DC (HVDC) AI data centre architectures. The new TP65H020G4PLSGBD D-Mode device delivers 20 milliohms (mΩ) on-resistance — one of the lowest in its class — in...

1 Oct 2026 | Thursday | NEWS

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