• Friday | 23 October 2026
SEEQC and NVIDIA Demonstrate 50% Improvement in Quantum Error Correction Performance

SEEQC, Inc. (“SEEQC” or the “Company”), a chip-based quantum computing company, announced results demonstrating significant performance improvements in quantum error correction decoding through a digital interface optimized multi-stage decoding architecture combining SEEQC’s chip-based pre-decoder technology with the NVIDIA Ising open family of AI models. SEEQC&rsquo...

23 Oct 2026 | Friday | NEWS
Atomera and IQE Partner to Develop High-Performance RF GaN-on-Silicon Wafers

Atomera, a semiconductor transistor materials and technology licensing company, announced it has entered into a Joint Development Agreement (JDA) with IQE plc, the leading global supplier of compound semiconductor wafer products and advanced material solutions, to bring high-performance, cost-effective RF GaN to market. The collaboration leverages Atomera’s recently announced application of ...

23 Oct 2026 | Friday | NEWS
Samsung Electro-Mechanics and NVIDIA Partner to Expand AI Chip Substrate Production in South Korea

Samsung Electro-Mechanics announced that it has entered into a strategic business partnership with NVIDIA to strengthen the global AI semiconductor supply chain and accelerate the expansion of next-generation AI infrastructure. Under the agreement, the two companies will jointly invest in expanding dedicated manufacturing facilities for ABF package substrates used in AI semiconductors. Leveraging...

22 Oct 2026 | Thursday | NEWS
Rocket One Partners with Virginia Commonwealth University to Develop Energy-Efficient Magnetic Computing Devices

Rocket One Inc. ("Rocket One" or the "Company") announced a sponsored research agreement with Virginia Commonwealth University ("VCU") to develop and demonstrate magnetic computing devices targeting a critical challenge in artificial intelligence: delivering greater computational capability while reducing energy consumption. The agreement establishes a one-year fabrication and testing progra...

21 Oct 2026 | Wednesday | NEWS
Great Sky Demonstrates Superconducting Chip for Real-Time Fusion Reactor Control

Great Sky, Brookhaven National Lab, Princeton Plasma Physics Laboratory, and the DIII-D National Fusion Facility partnered to develop a new kind of AI chip with the speed necessary to sense and respond to searing plasmas present in fusion reactors. The chips differ from conventional silicon chips — such as CPUs and GPUs — in fundamental ways. Instead of processing digital information u...

20 Oct 2026 | Tuesday | NEWS
Elektrobit and Microchip Partner to Simplify AUTOSAR Software Development

Elektrobit, a global expert in automotive software, and Microchip Technology Inc., a broadline supplier of semiconductors committed to making innovative design easier through total system solutions, announced a collaboration to simplify and accelerate AUTOSAR-based software development for automotive manufacturers and suppliers using Microchip automotive platforms. As the automotive industry move...

19 Oct 2026 | Monday | NEWS
IBM, Siemens Partner to Advance 3D Nanostack Transistors Beyond 7 Angstroms

IBM has joined forces with Siemens on semiconductor research aimed at moving its nanostack transistor architecture closer to scalable manufacturing, combining IBM’s device development expertise with Siemens’ capabilities in electronic design automation, process simulation and lithography optimisation. The companies will work on the design, modelling and manufacturing techniques requir...

16 Oct 2026 | Friday | NEWS
Applied Materials, UCLA Partner on AI Chip R&D at EPIC Center

Applied Materials has added the UCLA Samueli School of Engineering as a research collaborator at its Equipment and Process Innovation and Commercialization, or EPIC, Center in Silicon Valley, expanding the company’s academic partnerships around next-generation semiconductor development. Researchers from UCLA will work alongside Applied Materials scientists and engineers to address semicondu...

12 Oct 2026 | Monday | NEWS
GlobalFoundries, TSMC Sign $2 Billion Deal for US AI Chip Packaging Supply

GlobalFoundries has signed a $2 billion manufacturing agreement with TSMC to establish US production of silicon interposers used in advanced semiconductor packaging. Under the agreement, GlobalFoundries will expand manufacturing capacity at its facility in Malta, New York, where it will produce silicon interposers for TSMC’s CoWoS advanced packaging ecosystem. The companies have agreed an i...

12 Oct 2026 | Monday | NEWS
Wolfspeed Secures Conditional $1.5 Billion US Commitment for Domestic SiC Production

Wolfspeed has received a conditional commitment for up to $1.5 billion in long-term financing from the US Department of War through its Office of Strategic Capital, as the company looks to strengthen domestic production of silicon carbide and other wide-bandgap semiconductor technologies. The proposed financing carries a 30-year term and is intended to support the development and manufacture of s...

9 Oct 2026 | Friday | NEWS
MintNeuro Raises $5 Million to Scale Semiconductor Platform for Neural Devices

MintNeuro, a semiconductor company building specialised chips for neural devices from implants to wearables, announces a $5 million investment round to drive its commercial scale-up. MintNeuro's chips give device developers better performance than generic components, with less risk, lower cost and a faster route to market than custom chip design. The funding will accelerate product launch, expand ...

8 Oct 2026 | Thursday | NEWS
SEMIFIVE and Mobilint Partner to Develop Custom AI Chip for Robotics

Accelerates commercialisation of robotics AI chip through end-to-end "Spec Hand-off" development Integrates next-generation memory and interface technologies, including LPDDR6, PCIe Gen6 and UCIe-S Expands applications beyond data centre, HPC and edge AI into Physical AI, diversifying business portfolio SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announc...

2 Oct 2026 | Friday | NEWS
Hanmi Semiconductor Secures $5.8 Million MSVP Equipment Order from UTAC Thailand

South Korean semiconductor equipment maker Hanmi Semiconductor has secured a KRW 7.87 billion (approximately US$5.8 million) order from UTAC Thailand, the Thai subsidiary of Singapore-based semiconductor packaging and testing company UTAC. The order covers Hanmi Semiconductor’s micro SAW & VISION PLACEMENT (MSVP) equipment and is scheduled to run until 28 December 2026. The value of the ...

30 Sep 2026 | Wednesday | NEWS
MIPS and Xcelsa Labs Partner to Speed Custom Silicon Development with AI Design Optimisation

Accelerating the path to custom silicon: MIPS processor IP and Xcelsa’s Apex platform help customers move from software and workload requirements to formally verified, differentiated silicon faster. Optimizing hardware for demanding workloads: The collaboration combines MIPS’ software-first, workload-focused platforms with AI-driven design optimization to improve performance, powe...

30 Sep 2026 | Wednesday | NEWS
Wise Integration and Navitas Partner to Advance GaN and SiC Power Solutions for AI Datacentres

Wise Integration has announced a collaboration with Navitas Semiconductor to develop next-generation power-conversion solutions aimed at supporting the rapidly growing power requirements of artificial intelligence and high-performance computing systems. Under the collaboration, the two companies will combine Wise Integration’s digital power-control capabilities with Navitas Semiconductor&rsq...

29 Sep 2026 | Tuesday | NEWS
Singapore Launches SG Semiconductor Initiative to Expand Advanced R&D and Manufacturing

Singapore has introduced a new national initiative, SG Semiconductor, to strengthen the global profile of its semiconductor industry and attract further investment in advanced research and manufacturing. Developed by the Agency for Science, Technology and Research (A*STAR) and the Economic Development Board (EDB), the initiative will present Singapore’s semiconductor research, manufacturing ...

28 Sep 2026 | Monday | NEWS
Synopsys and TSMC Expand AI Chip Design Collaboration with Agentic AI and Advanced Packaging

Synopsys (Nasdaq: SNPS) announced innovations with TSMC that accelerate the development of next-generation AI, high-performance computing (HPC), and advanced semiconductor systems. Through AI-powered EDA flows, multiphysics-aware signoff methodologies, multi-die design flows, and silicon-proven Interface and Foundation IP, Synopsys and TSMC are helping customers address growing design complex...

25 Sep 2026 | Friday | NEWS
IonQ and SDT Strengthen South Korea Quantum Ecosystem with Superion 256 Partnership

IonQ (NYSE: IONQ), the world’s leading full-stack quantum platform and foundry, announced a strategic partnership with Korea-based quantum technology and software company SDT, Inc. Under this multi-year collaboration, IonQ will supply SDT with a Superion 256 quantum computer as well as IonQ’s silicon-vacancy (SiV) quantum memory module. "Demand for our new Superion 256 system is growi...

24 Sep 2026 | Thursday | NEWS
GSME and Teradyne Partner to Accelerate Semiconductor Test and Production Readiness

GS Microelectronics U.S., Inc. (GSME), a fast-growing semiconductor solutions provider, and Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, announced a multi‑year strategic partnership to establish a state‑of‑the‑art semiconductor test and evaluation center designed to accelerate customer time‑to‑market. The collaboration integra...

24 Sep 2026 | Thursday | NEWS
Valens Semiconductor and onsemi Collaborate on Cost-Optimised 3MP Automotive Camera Solution

Valens Semiconductor (NYSE: VLN), a leading provider of high-performance connectivity chipsets, announced a collaboration with onsemi on a cost-optimised integrated sensor for high-volume 3-megapixel automotive camera applications. Through this collaboration, the parties intend to give OEMs and Tier 1s a faster path to A-PHY. Under the agreement, Valens will work with onsemi on the cost-optimised...

23 Sep 2026 | Wednesday | NEWS

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