• Thursday | 12 November 2026
Infineon, SOLUM Partner on HVDC Power Solutions for AI Data Centres

German semiconductor manufacturer Infineon Technologies and South Korea's SOLUM have signed a memorandum of understanding (MoU) to expand their collaboration on high-voltage direct current (HVDC) power solutions for artificial intelligence data centres. Announced on 5 November 2026, the agreement builds on an existing technical relationship between the companies and will focus on three areas of p...

10 Nov 2026 | Tuesday | NEWS
Vertiv and Infineon Sign Three-Year Power Semiconductor Supply Agreement for AI Data Centre Infrastructure

Vertiv Holdings Co. (NYSE: VRT), a global leader in critical digital infrastructure, announced a three-year strategic agreement with Infineon Technologies AG (FSE: IFX /OTCQX: IFNNY) to deepen their long-standing collaboration and support long-term reliable access to, and supply of, critical silicon (Si) and silicon carbide (SiC) power semiconductors. The strategic agreement supports supply conti...

5 Nov 2026 | Thursday | NEWS
SambaNova and Supermicro Partner to Integrate SN50 AI Inference Chips into Data Centre Systems

Supermicro will work with SambaNova to develop leading-edge SN50 inference racks that operate alongside NVIDIA GPUs as part of Supermicro’s Data Center Building Block Solutions® (DCBBS) The strategic collaboration is initially planning for 10,000 RDU chips from SambaNova SambaNova, the AI chip company delivering the highest performance inference, announced that Supermicro (Nasdaq: ...

4 Nov 2026 | Wednesday | NEWS
Aeva and Micro-Epsilon Partner to Integrate High-Precision Sensing Technology into Industrial Automation

Aeva® (Nasdaq: AEVA), a leader in next-generation sensing and perception systems, announced that Micro-Epsilon, a global leader in high-precision sensing and measurement solutions, plans to integrate Aeva’s Eve™ high-precision technology into its next-generation sensing solutions. Trusted by major companies across the world, Micro-Epsilon ships more than 100,000 precision sensors ...

4 Nov 2026 | Wednesday | NEWS
Entegris Acquires Advanced Abrasives and Partners with Element Six to Develop Diamond-Based Cooling Materials for AI Chips

Entegris, Inc. (Nasdaq: ENTG), a leading supplier of critical advanced materials and process solutions for the semiconductor and other high-technology industries, announced two important milestones in its strategic expansion into the market for silicon carbide (SiC) and diamond-enabled thermal management materials solutions for next-generation AI advanced packaging. “Growth in AI compute, f...

4 Nov 2026 | Wednesday | NEWS
Cardiff, Swansea Partner to Develop UK Compound Semiconductor Pilot Foundry

Cardiff University and Swansea University have signed a Memorandum of Understanding (MoU) to examine the development of a coordinated national compound semiconductor pilot foundry network, strengthening the UK's capabilities in semiconductor research and manufacturing. Announced on 2 November 2026, the partnership will explore what the universities describe as the UK's first multi-institution mod...

3 Nov 2026 | Tuesday | NEWS
SambaNova and Oracle Partner to Deploy SN50 AI Inference Chips in OCI Data Centres

SambaNova and Oracle are collaborating to deploy SambaRack SN50 inference chips in Oracle Cloud Infrastructure (OCI) data centers. Oracle will offer the capacity to AI model builders. The plan adds high-performance inference chips to OCI’s growing range of AI infrastructure, giving customers more choice in how they run inference at scale. SambaNova, the AI chip company delivering ...

29 Oct 2026 | Thursday | NEWS
Japan Plans Additional ¥400 Billion Investment in Rapidus to Advance 2nm Chip Production

Japan's Ministry of Economy, Trade and Industry (METI) plans to seek an additional ¥400 billion (around US$2.5 billion) in government investment in chipmaker Rapidus over three fiscal years starting in 2027. The plan was disclosed on 19 October in documents submitted to a subcommittee of the Fiscal System Council, which advises Japan's Finance Minister. METI is seeking ¥150 billion in its...

28 Oct 2026 | Wednesday | NEWS
Nexperia Targets Doubling of India Revenue and Tripling of Local Footprint

Netherlands-based semiconductor maker Nexperia expects to double its revenue in India over the next few years and has committed to tripling its existing footprint in the country within five years, according to Interim CEO Stefan Tilgner. Tilgner made the remarks to ANI in The Hague during Union Commerce and Industry Minister Piyush Goyal's visit to the Netherlands. He said Nexperia has signed a j...

28 Oct 2026 | Wednesday | NEWS
Intel to Acquire Classiq to Build Full-Stack Quantum Computing Platform

Intel has agreed to acquire Classiq, an Israel-based developer of quantum software, as part of a plan to build a full-stack quantum computing platform. The deal, announced on 26 October 2026, is expected to close in the first half of 2027, subject to regulatory approvals and customary closing conditions. Financial terms were not disclosed. Classiq has developed a quantum algorithm synthesis platf...

28 Oct 2026 | Wednesday | NEWS
Infineon Invests €1.1 Billion in 300mm GaN Power Semiconductor Manufacturing in Austria

Infineon Technologies has announced an investment of around €1.1 billion at its Villach site in Austria to establish what it describes as the world's first high-volume manufacturing facility for gallium nitride (GaN) power semiconductors on 300mm wafers. High-volume production is scheduled to begin at the end of 2027, with investment continuing through 2034. The expansion will upgrade infras...

28 Oct 2026 | Wednesday | NEWS
SEEQC and NVIDIA Demonstrate 50% Improvement in Quantum Error Correction Performance

SEEQC, Inc. (“SEEQC” or the “Company”), a chip-based quantum computing company, announced results demonstrating significant performance improvements in quantum error correction decoding through a digital interface optimized multi-stage decoding architecture combining SEEQC’s chip-based pre-decoder technology with the NVIDIA Ising open family of AI models. SEEQC&rsquo...

23 Oct 2026 | Friday | NEWS
Atomera and IQE Partner to Develop High-Performance RF GaN-on-Silicon Wafers

Atomera, a semiconductor transistor materials and technology licensing company, announced it has entered into a Joint Development Agreement (JDA) with IQE plc, the leading global supplier of compound semiconductor wafer products and advanced material solutions, to bring high-performance, cost-effective RF GaN to market. The collaboration leverages Atomera’s recently announced application of ...

23 Oct 2026 | Friday | NEWS
Samsung Electro-Mechanics and NVIDIA Partner to Expand AI Chip Substrate Production in South Korea

Samsung Electro-Mechanics announced that it has entered into a strategic business partnership with NVIDIA to strengthen the global AI semiconductor supply chain and accelerate the expansion of next-generation AI infrastructure. Under the agreement, the two companies will jointly invest in expanding dedicated manufacturing facilities for ABF package substrates used in AI semiconductors. Leveraging...

22 Oct 2026 | Thursday | NEWS
Rocket One Partners with Virginia Commonwealth University to Develop Energy-Efficient Magnetic Computing Devices

Rocket One Inc. ("Rocket One" or the "Company") announced a sponsored research agreement with Virginia Commonwealth University ("VCU") to develop and demonstrate magnetic computing devices targeting a critical challenge in artificial intelligence: delivering greater computational capability while reducing energy consumption. The agreement establishes a one-year fabrication and testing progra...

21 Oct 2026 | Wednesday | NEWS
Great Sky Demonstrates Superconducting Chip for Real-Time Fusion Reactor Control

Great Sky, Brookhaven National Lab, Princeton Plasma Physics Laboratory, and the DIII-D National Fusion Facility partnered to develop a new kind of AI chip with the speed necessary to sense and respond to searing plasmas present in fusion reactors. The chips differ from conventional silicon chips — such as CPUs and GPUs — in fundamental ways. Instead of processing digital information u...

20 Oct 2026 | Tuesday | NEWS
Elektrobit and Microchip Partner to Simplify AUTOSAR Software Development

Elektrobit, a global expert in automotive software, and Microchip Technology Inc., a broadline supplier of semiconductors committed to making innovative design easier through total system solutions, announced a collaboration to simplify and accelerate AUTOSAR-based software development for automotive manufacturers and suppliers using Microchip automotive platforms. As the automotive industry move...

19 Oct 2026 | Monday | NEWS
IBM, Siemens Partner to Advance 3D Nanostack Transistors Beyond 7 Angstroms

IBM has joined forces with Siemens on semiconductor research aimed at moving its nanostack transistor architecture closer to scalable manufacturing, combining IBM’s device development expertise with Siemens’ capabilities in electronic design automation, process simulation and lithography optimisation. The companies will work on the design, modelling and manufacturing techniques requir...

16 Oct 2026 | Friday | NEWS
Applied Materials, UCLA Partner on AI Chip R&D at EPIC Center

Applied Materials has added the UCLA Samueli School of Engineering as a research collaborator at its Equipment and Process Innovation and Commercialization, or EPIC, Center in Silicon Valley, expanding the company’s academic partnerships around next-generation semiconductor development. Researchers from UCLA will work alongside Applied Materials scientists and engineers to address semicondu...

12 Oct 2026 | Monday | NEWS
GlobalFoundries, TSMC Sign $2 Billion Deal for US AI Chip Packaging Supply

GlobalFoundries has signed a $2 billion manufacturing agreement with TSMC to establish US production of silicon interposers used in advanced semiconductor packaging. Under the agreement, GlobalFoundries will expand manufacturing capacity at its facility in Malta, New York, where it will produce silicon interposers for TSMC’s CoWoS advanced packaging ecosystem. The companies have agreed an i...

12 Oct 2026 | Monday | NEWS

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