• Sunday | 08 February 2026
Equinix and Lenovo Power Merck KGaA’s Digital Leap: New Supercomputer Accelerates Drug Discovery and Semiconductor Innovation

Equinix and Lenovo to provide digital foundation for Merck KGaA, Darmstadt, Germany— from accelerating drug discovery to pioneering new materials for next-generation semiconductor chips Equinix, Inc. (Nasdaq: EQIX), the world's digital infrastructure company®,  announced Merck KGaA, Darmstadt, Germany, a leading science and technology company, has successfully launched a ...

21 Nov 2025 | Friday | NEWS
Beneq Launches Transmute to Bring Atomic Layer Deposition to True High Volume Semiconductor Manufacturing

New platform delivers ALD film quality at production throughput for Wide Bandgap and other specialty device manufacturing Beneq, a global leader in Atomic Layer Deposition (ALD) equipment and solutions, announced Beneq Transmute™, a next-generation ALD platform designed for high-volume semiconductor manufacturing. Engineered for high volume production of Wide Bandgap (WBG) power electronics...

20 Nov 2025 | Thursday | NEWS
BAE Systems Expands RH12 Storefront to Accelerate Next Generation Radiation Hardened Chip Development

RH12™ Storefront offers a one-stop-shop for new integrated circuits that withstand the harsh space environment  BAE Systems (LON: BA) has added new capabilities to its next-generation, radiation-hardened 12 nanometer (nm) Storefront. The RH12™ Storefront is an advanced and accessible integrated circuit development capability with a vast technology library to support a wide r...

20 Nov 2025 | Thursday | NEWS
QuickLogic eFPGA Hard IP Selected by Chipus for High Performance Data Center ASIC on Proven 12 nm Process

 QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP and ruggedized FPGAs, announced  that its eFPGA Hard IP was selected by Chipus for a high performance data center production ASIC that will be fabricated on an industry-proven 12 nm process technology.  eFPGA IP was a central requirement for this high-performance ASIC and underscores how QuickLogic's...

19 Nov 2025 | Wednesday | NEWS
Accton Edgecore, 1Finity and Liqid Forge Collaboration To Deliver Long Distance All Photonic Connectivity for AI Datacenters

Accton/Edgecore Networks, 1Finity (a Fujitsu company), and Liqid are pleased to announce a strategic collaboration to develop and deliver a cutting-edge datacenter solution that enables seamless all-photonic network connectivity across long distances from several kilometers to several hundred kilometers. The solution is designed to maintain high transmission rates, low latency, and zero throughp...

19 Nov 2025 | Wednesday | NEWS
Phison Launches New Gen5 Enterprise SSDs and AI Memory Technology To Power the Next Wave of AI Computing

-Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, announced its next-generation PCIe Gen5 enterprise SSDs, the Pascari X201 and Pascari D201, and a demonstration of AI agents running on a laptop PC powered by an integrated GPU and Phison aiDAPTIV+ GPU memory extension technology. Together, these innovations deliver the performance needed to power AI w...

19 Nov 2025 | Wednesday | NEWS
Dell and NVIDIA Unveil Next-Gen AI Factory to Accelerate Enterprise Deployment with Integrated Automation, Storage, and Compute

Dell AI Factory with NVIDIA advancements accelerate deployment of AI applications, from traditional to agentic, creating integrated, efficient IT environments Dell ObjectScale and PowerScale, the Dell AI Data Platform’s storage engines, accelerate workflows for AI applications and high performance compute with NVIDIA Dynamo integration Dell Automation Platform expansion offers automate...

18 Nov 2025 | Tuesday | NEWS
Tescan Strengthens Semiconductor Workflows with the New FemtoChisel Femtosecond Laser Platform

Tescan expands its semiconductor portfolio with FemtoChisel, a next-generation femtosecond laser platform designed to enhance semiconductor sample preparation workflows with exceptional speed, precision, reproducibility, and quality. Tescan FemtoChisel: Femtosecond processing, faster sample preparation. FemtoChisel was developed specifically for semiconductor research and failure analysis ...

17 Nov 2025 | Monday | NEWS
yieldWerx and iTest Form Strategic Collaboration to Deliver Integrated Test Data Intelligence

yieldWerx, a leading provider of end-to-end semiconductor test data and yield analytics, announced a strategic collaboration with iTest, a premier independent IC testing laboratory based in Silicon Valley. This partnership integrates yieldWerx's enterprise-grade analytics platform directly into iTest's production environment, enabling customers to access advanced data visualization, AI-powe...

17 Nov 2025 | Monday | NEWS
Trio-Tech CEO S.W. Yong Highlights Strong Start to FY2026 as Revenue Surges 58%

Trio-Tech International (NYSE MKT: TRT), a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, today announced financial results for its fiscal first quarter ended September 30, 2025. The Company reported 58% year-over-year revenue growth, driven by strong performance across both its Semiconductor Back-End and Industrial Electroni...

17 Nov 2025 | Monday | Company results
Alpha and Omega Semiconductor Approves $30 Million Share Repurchase Program

Alpha and Omega Semiconductor Limited announced that its Board of Directors has approved a new share repurchase program under which the Company is authorized to repurchase up to $30 million of the Company’s outstanding common shares from time to time. “This new share repurchase program reflects the Board and management team’s confidence in the AOS’s business strategy, fina...

17 Nov 2025 | Monday | NEWS
Fabric8Labs Secures $50 Million to Expand U.S. Electrochemical Additive Manufacturing Capacity

Fabric8Labs, the company pioneering Electrochemical Additive Manufacturing, announced a $50 million funding round to expand its U.S.-based advanced manufacturing facilities, boosting capacity to produce tens of millions of components annually. Powered by its breakthrough Electrochemical Additive Manufacturing (ECAM) technology, Fabric8Labs is scaling up production of next-generation electronic...

14 Nov 2025 | Friday | NEWS
Renesas Sets New Standard for DDR5 Memory Interfaces with 9600 MT/s RCD Optimized for AI and HPC Workloads

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, announced that it has delivered the industry’s first sixth-generation Registered Clock Driver (RCD) for DDR5 Registered Dual In-line Memory Modules (RDIMMs). The new RCD is the first to achieve a data rate of 9600 Mega Transfers Per Second (MT/s), surpassing the industry standard. This brea...

13 Nov 2025 | Thursday | NEWS
Semtech’s LoRa USP™ Enables Utilities to Overcome Protocol Fragmentation and Streamline Smart Metering Deployment

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced its Unified Software Platform (USP) for LoRa Plus devices, which leverage fourth-generation LoRa® technology to enable advanced multi-protocol support. LoRa USP™ addresses a critical industry challenge: managing L...

13 Nov 2025 | Thursday | NEWS
Wolfspeed and Hopewind Collaborate to Bring Silicon Carbide Innovation to Global Wind Energy Systems

Wolfspeed, Inc. (NYSE: WOLF), a global leader in innovative silicon carbide power solutions, announced a collaboration with Hopewind, a global innovator in renewable energy solutions. Together, the two companies will advance the development of the next generation of wind power solutions by integrating Wolfspeed’s cutting-edge 2.3kV LM Pack Module into Hopewind’s advanced highly modul...

11 Nov 2025 | Tuesday | NEWS
Tsavorite Introduces Composable AI Computing Platform Built for the Age of Agentic Workflows

Integrated, Composable Platform Delivers Dramatic Improvements in Performance, Cost and Scalability for Training, Reinforcement Learning, Inference and Agentic Workflows -Tsavorite Scalable Intelligence, a pioneering AI computing solutions provider, announced its groundbreaking composable, compute architecture that sets a new industry standard for performance, scalability and affordab...

11 Nov 2025 | Tuesday | NEWS
Pixelworks' Distributed Rendering Solution Powers realme GT8 Series R1 Gaming Chip for PC-Level Visuals

Distributed Rendering Solution Unlocks a New Visual Experience with Low Power Consumption and High Image Quality Pixelworks, Inc. (NASDAQ: PXLW), a leading provider of visual processing solutions,  announced that it offers an advanced distributed rendering solution for the R1 gaming chip equipped in the realme GT8 series smartphones. By integrating ultra-low latency MotionEngi...

10 Nov 2025 | Monday | NEWS
CELUS and NextPCB Partner to Streamline Electronics Design-to-Production Workflow

CELUS, the developer of a leading AI-assisted electronics design platform, and NextPCB, a globally recognized PCB manufacturing and assembly service provider, announced a strategic partnership aimed at streamlining the electronics development lifecycle from concept to mass production. Through this partnership, NextPCB users will gain access to the CELUS Design Platform for seamless idea creatio...

7 Nov 2025 | Friday | NEWS
Ceva and Microchip Announce Long-Term Partnership to Bring Scalable AI Processing Across Microchip's Product Portfolio

Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, announced a long-term partnership with Microchip Technology Inc. (NASDAQ: MCHP), a broadline supplier of semiconductors committed to making innovative design easier through total system solutions. This collaboration will embed Ceva's NeuPro™ family of Neural Processing Units (NPUs) in Microchip's...

6 Nov 2025 | Thursday | NEWS
Mouser Electronics Launches New EIT Series Focused on the Future of Urban Air Mobility

--Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, released its latest installment of the Empowering Innovation Together (EIT) technology series, Urban Transport Takes Flight, examining the emerging sector of Advanced Air Mobility (AAM). This series details the technology behind electric vertical takeoff and lan...

6 Nov 2025 | Thursday | NEWS

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