• Wednesday | 24 June 2026
Samsung Unveils Industry’s First UFS 5.0 Storage, Advancing On-Device AI Performance

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced that, for the first time in the industry, it has developed the industry's fastest Universal Flash Storage (UFS) 5.0 solution, which will help enable seamless and highly efficient AI services on future mobile devices. The milestone sets a new benchmark for the next-generation mobile memory market as the enhanc...

24 Jun 2026 | Wednesday | NEWS
Qnity Launches Advanced Packaging Innovation Hub to Accelerate AI and Next-Generation Semiconductor Growth

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced the launch of its Advanced Packaging Innovation Hub, underscoring advanced packaging as a strategic growth driver and innovation priority for the company. The new online platform showcases Qnity’s breadth of material and technology solutions desi...

24 Jun 2026 | Wednesday | NEWS
Magnachip Launches 6th-Generation 600V SJ MOSFETs to Address Rising AI Server and EV Charging Demand

Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) announced the introduction of two new 6th-generation 600V Super Junction (SJ) MOSFETs designed to meet the growing performance and efficiency requirements of AI servers, EV charging systems and industrial power applications. The new products feature low RDS(ON) values of 36mΩ and 37mΩ, helping reduce conduction lo...

24 Jun 2026 | Wednesday | NEWS
Torex Launches Zero-Current Load Switch ICs for Ultra-Low-Power Applications

Torex Semiconductor Ltd. (TOKYO Prime: 6616) has developed the XC8115/XC8116 Series, multifunction load-switch ICs that achieve 0 µA current consumption. Featuring ultra-low power consumption, space-saving operation up to 105°C, and functions required for power sequence control, these multifunction load switch ICs are easy to use across a wide range of applications, including industrial ...

23 Jun 2026 | Tuesday | NEWS
Qnity Unveils Advanced Packaging Materials for AI and High-Performance Computing Chips

Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redi...

11 Jun 2026 | Thursday | NEWS
Mr. Kosuke Inoue of Asahi Kasei on Advancing Materials Innovation for AI-Driven Semiconductor Packaging

In this interview with Semicon Leaders Asia, Mr. Kosuke Inoue, Vice Sales General Manager at Asahi Kasei, outlines how the rapid growth of AI and high-performance computing is reshaping semiconductor packaging requirements and driving demand for advanced materials solutions. He highlights the company’s strategy to support next-generation package architectures through innovations in PSPI...

8 Jun 2026 | Monday | Interaction
Wiwynn Showcases Rack-Scale AI Infrastructure and Next-Generation Data Centre Technologies at Computex 2026

Wiwynn (6669), an innovative cloud IT infrastructure provider for data centres, today announced to showcase its vision of next-generation data centre designs at Computex 2026 (Booth #J0106, TaiNEX1). The exhibition spans cutting-edge rack-scale AI servers, developed with Wistron, breakthrough cooling technologies, optical scale-up designs, and high-voltage DC (HVDC) power delivery architectures. ...

27 May 2026 | Wednesday | NEWS
Toshiba Electronic Devices & Storage Corporation Launches TXZ+™ Entry-Class M4H Microcontrollers for Consumer and Industrial System Control

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has announced the TXZ+™ Family Entry‑Class M4H Group, standard microcontrollers[1] featuring an Arm® Cortex®‑M4 core with a floating-point unit (FPU). The new microcontrollers are designed for application in small‑scale system control of consumer products, such as air conditioners a...

27 May 2026 | Wednesday | NEWS
King Yuan Electronics Corp Invests S$100 Million in Singapore Semiconductor Testing Facility

Taiwanese semiconductor testing company King Yuan Electronics Corp (KYEC) is investing S$100 million in a new semiconductor testing facility in Singapore as part of its broader international expansion strategy. The project is expected to create more than 300 jobs across engineering, operations and management roles, strengthening Singapore’s position within the global semicond...

25 May 2026 | Monday | NEWS
NoMIS Power Joins $2.5M US Grid Modernisation Project to Advance SiC HVDC Power Technology

NoMIS Power Corporation, a leader in advanced Silicon Carbide (SiC) power semiconductor technology, announced its participation as an industry partner in a three-year, $2.5 million project led by Michigan State University (PI: Dr Omid Beik) to develop high-voltage SiC-based Neutral Point Clamped Power Electronics Building Blocks (NPC-PEBBs) as vendor-agnostic, plug-and-play sub...

18 May 2026 | Monday | NEWS
Mouser Electronics Earns TE Connectivity’s Global High Service Distributor Award for 12th Time

Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, announces it has been honored for the twelfth time as the Global High Service Distributor of the Year from TE Connectivity (TE). Recognised worldwide as a leader in connectors and sensors, TE awarded Mouser this prestigious distribution accolade, also know...

14 May 2026 | Thursday | NEWS
HYFIX Spatial Intelligence Launches Integrated Navigation and Compute Module for Autonomous Drone Systems

HYFIX Spatial Intelligence announced the immediate availability of samples and evaluation kits for the H1P Positioning, Navigation, and Open-Compute Module for small unmanned systems. The announcement will be showcased at AUVSI XPONENTIAL 2026 (Booth 34005), the leading industry event for autonomy and robotics. The H1P integrates HYFIX's H1 Autonomous Systems Chip into a compact, i...

13 May 2026 | Wednesday | NEWS
Samsung Electronics Standardises Global Software Development on Oracle Java SE Universal Subscription

Oracle announced that the Oracle Java SE Universal Subscription will help standardise global software development at Samsung Electronics, a world leader in advanced semiconductor technology. With the Oracle Java SE Universal Subscription, Samsung can simplify IT operations and strengthen security by consolidating its global internal application development on Oracle Java. To continue to expa...

13 May 2026 | Wednesday | NEWS
Mouser Electronics Named Americas Distributor of the Year by Harwin

Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, announces that it has been awarded the Americas Distributor of the Year Award from Harwin, a world leader in the manufacture of interconnect components. Harwin cited Mouser's continued sales and customer growth for the fiscal year (April 2025 to March 2026), co...

14 Apr 2026 | Tuesday | NEWS
Parade Technologies Launches DP 2.1a MST Hub for Automotive and Display Expansion

Parade Technologies, Ltd. (Taiwan OTC: 4966.TWO), a leading high-speed interface, video display, and touch controller IC supplier, announces the availability of PS8651V DP 2.1a/HBR3 1:2 MST hub controller for automotive, accessories and video display designs that need DP/eDP port expansion. It adds to Parade’s DP MST Hub solutions, which include the PS8650 DP 2.1a/UHBR20 1:4 MST hub controll...

6 Apr 2026 | Monday | NEWS
NUBURU Secures Initial Counter-Drone Deployment in Asia-Pacific

NUBURU, Inc. (NYSE American: BURU – the “Company”), a dual-use Defense & Security platform company focused on non-kinetic effects, directed-energy technologies, electronic warfare and software-orchestrated defense systems,  announced that its wholly owned subsidiary, Lyocon S.r.l. (“Lyocon”), has secured an initial deployment order for its portable directed-e...

6 Apr 2026 | Monday | NEWS
L Squared Launches Continuation Fund to Accelerate BTX Precision Growth

L Squared Capital Partners (“L Squared”) is pleased to announce the successful closing of a single-asset continuation fund for BTX Precision (“BTX” or the “Company”), a leading high-precision manufacturer of mission-critical components and assemblies. The platform’s unmatched breadth of additive and subtractive manufacturing capabilities – including ...

3 Apr 2026 | Friday | NEWS
UK Launches £10.4M EXPRESS Programme to Advance Next-Generation Semiconductor Materials

A new UK research initiative led by the University of Warwick and the University of Southampton aims to accelerate the development of advanced semiconductor materials for future electronic applications. The five-year EXPRESS programme, supported by £10.4 million in funding from the Engineering and Physical Sciences Research Council (EPSRC), will focus on enabling next-generation transistor ...

1 May 2026 | Friday | NEWS
Toshiba, ROHM and Mitsubishi Electric Explore Semiconductor Integration

Japan’s Toshiba, ROHM, and Mitsubishi Electric have signed a memorandum of understanding (MoU) to begin discussions on potentially combining parts of their semiconductor operations. The proposed collaboration would involve integrating the semiconductor activities of Toshiba’s subsidiary, Toshiba Electronic Devices & Storage Corporation, alongside ROHM’s chip business and Mit...

1 May 2026 | Friday | NEWS
EPIC Microsystems Secures $21M Series A to Advance AI Data Centre Power Delivery

 EPIC Microsystems, a semiconductor company developing breakthrough power delivery solutions for AI infrastructure, announced it has raised an oversubscribed $21 million in Series A funding to accelerate the development and commercialisation of its vertical power delivery technology for next-generation AI compute platforms. The funding round was led by Seligman Ventures, with participation fr...

26 Mar 2026 | Thursday | NEWS

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