Andes Technology Cuts Chip Design and Verification Time with ChipAgents AI

ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced that Andes Technology, a leading supplier of RISC-V processor IP and a Founding Premier member of RISC-V International, has successfully deployed ChipAgents across multiple processor design and verification projects. In production deployments, Andes reduced a processor customisation task f...

3 Sep 2026 | Thursday | NEWS
Movandi Launches Ultra-Low-Power Frequency Synthesiser ICs for 5G, AI Data Centres and Robotics

Movandi, the semiconductor and systems connectivity company powering intelligent wireless infrastructure, announced the MV3564 and MV3514 frequency synthesisers, two new pin- and feature-compatible devices designed for wireless communications, AI data centres, and physical AI applications. Leveraging TSMC’s 40nm radio frequency (RF) CMOS process, the devices deliver 75 fs total jitter at jus...

28 Aug 2026 | Friday | NEWS
Keysight Helps AttoTude Cut AI Chip Design Cycles by More Than 50%

Keysight Technologies has announced that AttoTude, a developer of advanced ASICs for AI and hyperscale data-centre applications, has expanded its use of Keysight’s electronic design automation (EDA) software across its complete IC design workflow. The collaboration has enabled AttoTude to reduce its chip design cycles by more than 50% and achieve first-pass silicon success across advanced RF...

28 Aug 2026 | Friday | NEWS
GCT Semiconductor Partners on Next-Generation UAV Connectivity and Defence Technologies

GCT Semiconductor Holding, Inc. (“GCT”) (NYSE: GCTS), a leading designer and supplier of 5G semiconductors powering the AI data pipeline with wireless connectivity, announced a strategic partnership and license agreement with a leading infrastructure provider for utilities and IoT to accelerate the development of next-generation UAV control and communication technologies. As part ...

27 Aug 2026 | Thursday | NEWS
NEO Semiconductor Launches NEO.AI Memory Platform to Break AI Memory Bottlenecks

NEO Semiconductor, a leading innovator in advanced AI and memory technologies, announced the launch of NEO.AI, its next-generation AI memory platform designed to solve the two most significant memory bottlenecks limiting future artificial intelligence systems: on-chip memory (AI cache) and HBM capacity. As part of the platform launch, the company is officially unveiling X-SRAM, its breakthrou...

6 Aug 2026 | Thursday | NEWS
Keysight Certifies RFPro EM Design Software for Intel 14A and 18A-P Process Technologies

Keysight Technologies, Inc. (NYSE: KEYS) announced certification of its RFPro electromagnetic (EM) design software, part of the Keysight EDA Advanced Design System (ADS), for Intel 14A and Intel 18A-P process technologies. The certification gives radio frequency integrated circuit (RFIC) and mixed-signal designers confidence that their electromagnetic simulations accurately reflect Intel Foun...

29 Jul 2026 | Wednesday | NEWS
Synopsys and NVIDIA Advance Agentic AI for Semiconductor Design with Autonomous Chip Verification and Engineering Workflows

Synopsys, Inc. (NASDAQ: SNPS) announced advancements to agentic AI for engineering in collaboration with NVIDIA. Synopsys has developed fully autonomous, long-running agentic capabilities for chip design and electronics system design enabled with NVIDIA Nemotron on NVIDIA's accelerated computing platform and secured by the NVIDIA OpenShell runtime. Demonstrated at DAC for the first ...

28 Jul 2026 | Tuesday | NEWS
ChipNexus Launches NEX Agentic AI Platform for Semiconductor Design, Raises Seed Funding

Primis AI announced that it has become ChipNexus and launched NEX, an agentic AI platform for semiconductor and hardware design. The new identity reflects the company’s evolution in response to a changing market: hardware teams increasingly need AI systems that can work across complex engineering workflows, not simply generate code or answer questions. ChipNexus developed NEX to address that...

27 Jul 2026 | Monday | NEWS
Cadence Launches AuraStack AI Super Agent for PCB and Advanced Packaging Design, Powered by NVIDIA Blackwell

Cadence (Nasdaq: CDNS) introduced the AuraStack™ AI Super Agent on Cadence® Allegro® AI Studio, the world’s first agentic AI platform for printed circuit board (PCB) and advanced packaging design, taking designers from system planning to final product in a single AI-native environment. The Cadence AuraStack AI Super Agent, accelerated by NVIDIA Blackwell and NVIDIA CUDA-X, coor...

17 Jul 2026 | Friday | NEWS
Whalechip Deploys ChipAgents AI Platform to Accelerate Semiconductor Chip Debugging

ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced that Whalechip has successfully deployed ChipAgents' AI-powered platform, which immediately paid dividends during a recent critical chip debugging effort. Using ChipAgents, the Whalechip engineering team was able to rapidly identify critical design issues in a new chip and significantly reduce ...

16 Jul 2026 | Thursday | NEWS
Direxion Launches 2X Leveraged ETF Tracking SK hynix to Expand AI Semiconductor Investment Portfolio

Direxion, a provider of exchange-traded funds designed for active and tactical investors, has expanded its semiconductor investment portfolio with the launch of the Direxion Daily SK Hynix Bull 2X ETF (SKHL). The new fund is designed to provide investors with leveraged exposure to one of the world's leading memory chip manufacturers, enabling traders to capitalise on daily price ...

16 Jul 2026 | Thursday | NEWS
Tomocube Launches Desktop 3D Metrology System for Glass Substrate Inspection

Tomocube, a 3D non-destructive inspection and metrology company, announced the launch of HT-T1 Desktop (HT-T1D), a desktop holotomography system for high-resolution 3D defect analysis of glass substrates used in next-generation semiconductor packaging. HT-T1D is optimised for glass-substrate inspection and metrology workflows. When conventional in-line panel inspection tools, such as automated op...

14 Jul 2026 | Tuesday | NEWS
Synopsys Shifts Focus to AI Chip Design as It Phases Out Selected Semiconductor Manufacturing Software

Electronic design automation (EDA) company Synopsys is reportedly planning to discontinue parts of its semiconductor manufacturing process control software portfolio as it shifts engineering resources towards higher-growth artificial intelligence (AI) design solutions. According to sources familiar with the matter, the company has informed several leading semiconductor manufacture...

9 Jul 2026 | Thursday | NEWS
AOS Launches 80V Half-Bridge MOSFET with AmpStack™ Packaging for AI Data Centres and High-Power Applications

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide-bandgap power devices, power management ICs, and modules, introduced its AOPL66801 80V MOSFET in a half-bridge configuration available in a state-of-the-art DFN6x5 AmpStack™ MOSFET package. This breakthrough packaging technolog...

8 Jul 2026 | Wednesday | NEWS
How AI-Powered EDA, 2nm Design, and Samsung Foundry Collaboration Are Accelerating Next-Generation AI Chip Development

In this exclusive interview with Semicon Leaders Asia, Shekhar Kapoor, Executive Director of Product Line Management, Synopsys, shares how AI-driven design automation, advanced-node collaboration, and system-level optimisation are shaping the future of semiconductor innovation.   Q. As AI, multi-die architectures, and advanced process nodes increase desig...

3 Jul 2026 | Friday | Interaction
Sirin Software Joins Alif Semiconductor Ecosystem as Authorized Design House

Sirin Software, a leading provider of embedded software and IoT engineering services, has officially joined the Alif Semiconductor partner ecosystem as an authorised Design House. The collaboration brings together Alif Semiconductor's high-performance processor architectures and Sirin Software's expertise in embedded software engineering to help customers accelerate the development of next-generat...

2 Jul 2026 | Thursday | NEWS
OXMIQ Raises $35 Million Series A to Scale Licensable GPU Architecture for Custom AI Silicon

OXMIQ Labs Inc., a unified GPU and AI architecture company founded by Raja Koduri, closed its $35 million Series A financing, bringing the company’s total capital raised to $60 million. The funding will scale OxCore™, OXMIQ’s licensable GPU architecture that allows semiconductor companies and AI system builders to build custom AI silicon without a full chip program. The round was...

2 Jul 2026 | Thursday | NEWS
StratEdge Introduces Gold-Plated Tabs for High-Power GaN Semiconductor Packaging

StratEdge Corporation, a leader in the design and production of high-frequency, high-power, and high-reliability packages, offers gold-plated tabs for advanced semiconductors that require superior thermal and electrical performance. StratEdge’s gold-plated tabs are designed to support eutectic die attach for gallium nitride (GaN) and other high-power devices using gold-tin (AuSn) and gold-s...

2 Jul 2026 | Thursday | NEWS
ChipAgents Joins AWS Partner Network to Expand AI-Driven Semiconductor Engineering Capabilities

ChipAgents, a leading provider of Agentic AI platforms in the semiconductor design industry, announced that it has joined the Amazon Web Services (AWS) Partner Network (APN), a global community of AWS Partners that leverage programs, expertise and resources to build, market and sell customer offerings. “AI has enormous potential in semiconductor engineering, but the industry’s biggest...

26 Jun 2026 | Friday | NEWS
GigaDevice and Qt Group Partner to Accelerate Embedded HMI Development on GD32H7 MCU Platform

GigaDevice, a leading semiconductor company specialising in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has officially entered a strategic partnership with Qt Group, a global leader in software design, development, and quality assurance solutions. Leveraging the GD32H7 high-performance MCU series, the two companies will collaborate...

25 Jun 2026 | Thursday | NEWS