Renesas Expands RA8 Series with 1 GHz Cortex-M85 MCUs for AI, Industrial and Graphics-Driven Applications

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, introduced the RA8M2 and RA8D2 microcontroller (MCU) groups. Based on a 1 GHz Arm® Cortex®-M85 processor with an optional 250 MHz Arm®Cortex®-M33 processor, the new MCUs are the latest Renesas offerings to deliver an unmatched 7300 Coremarks of raw compute performance, the industry...

23 Oct 2025 | Thursday | NEWS
Green Hills Software Delivers Safety-Certified Development Tools for Infineon’s PSOC™ Edge Microcontroller Family

This combined hardware and software solution is ideal for streamlining the creation, development, and deployment of optimized safe and secure applications for robotics, vision monitoring, and HMI Green Hills Software, the worldwide leader in embedded safety and security,  announced the immediate availability of its advanced safety-certified development tools for Infineon Technolo...

22 Oct 2025 | Wednesday | NEWS
SuperX Unveils GB300 NVL72 System, a Rack-Scale AI Supercomputer Powered by NVIDIA Grace Blackwell Ultra for Trillion-Parameter Model Training

SuperX AI Technology Limited  announced the launch of the SuperX GB300 NVL72 System, a groundbreaking, rack-scale AI supercomputing platform powered by the NVIDIA GB300 Grace Blackwell Ultra Superchip. Designed to conquer the physical and computational limits of training and deploying next-generation trillion-parameter models, the liquid-cooled GB300 System delivers a significant leap in pe...

17 Oct 2025 | Friday | NEWS
Qnity™ and SK hynix Forge Strategic Collaboration to Advance Semiconductor Manufacturing with High-Performance CMP Materials

Strategic Collaboration to Support Advanced Semiconductor Manufacturing with High-Performance Materials Qnity, DuPont's Electronics business, a premier technology solutions leader across the semiconductor value chain,  announced the signing of a Memorandum of Understanding (MOU) with SK hynix, establishing a strategic long-term agreement for the supply of polishing pads for chemical mechan...

17 Oct 2025 | Friday | NEWS
Silicon Box Reaches 100-Million-Unit Milestone at Singapore Facility, Setting New Benchmark for Advanced Semiconductor Packaging Yield and Scale

Breakthrough yield and device performance at high volume show team can scale company's large-format advanced packaging for customers' cutting-edge applications  Silicon Box, a global leader in chiplet integration and advanced semiconductor packaging, announced it has shipped 100-million-units from its flagship factory in Singapore's Tampines Wafer Park. The state-of-the-art facility, which...

16 Oct 2025 | Thursday | NEWS
MediaTek and NVIDIA Extend Partnership to Power a New Era of Personal AI Supercomputing

Continues MediaTek's long history of collaboration with NVIDIA to advance AI innovation from supercomputers to vehicles, IoT devices, data center solutions, and beyond  MediaTek has teamed with NVIDIA on the design of the GB10 Grace Blackwell Superchip in NVIDIA DGX Spark, a personal AI supercomputer that allows developers to prototype, fine-tune, and inference large AI models on the ...

16 Oct 2025 | Thursday | NEWS
Semiconductor Research Corporation Unveils MAPT Roadmap 2.0 to Accelerate U.S. Semiconductor Innovation and Workforce Growth

Semiconductor Research Corporation (SRC) is proud to announce the release of the Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap 2.0, a comprehensive update to the industry’s first 3D semiconductor roadmap. This second edition reflects the contributions of over 370 experts from 132 organizations across industry, academia, and government, and builds upon the momentum of ...

15 Oct 2025 | Wednesday | NEWS
Johnson Controls Expands Silent-Aire Platform with Scalable CDU Solutions for AI-Driven Data Centres in Asia Pacific

Silent-Aire CDUs offer scalable cooling from 500kW to 10MW for high-density data centres in Asia Pacific Flexible, space-saving design with built-in redundancy helps achieve maximum availability and rapid deployment in dense urban markets like Singapore Johnson Controls full thermal portfolio can cut non-IT energy use by up to 50%, boosting efficiency even in warm-climate data cent...

14 Oct 2025 | Tuesday | NEWS
Kioxia Expands RocksDB Plug-In to Boost SSD Performance and Lifespan in RAID Configurations

  Kioxia Corporation, announced an expanded RocksDB plug-in that enhances SSD lifespan and performance in multi-drive RAID environments. Building on its earlier demonstration of a Flexible Data Placement (FDP)-enabled SSD running RocksDB, the company will showcase this advancement at the upcoming Open Compute Project (OCP) Global Summit. In a 4-drive RAID 5 setup, Kioxia’s new plug-in...

13 Oct 2025 | Monday | NEWS
Momentus Inc. Awarded $5.1M NASA Contract to Support In-Space Microgravity Crystallization Demonstration

Momentus Inc. (NASDAQ: MNTS), a U.S. commercial space company offering satellites, satellite components, and in-space transportation and services, announced that it was awarded a $5.1 million contract on September 26 by NASA’s Flight Opportunities program to support the Commercial Orbital System for Microgravity In-Space Crystallization (COSMIC) demonstration, a pioneering technology desig...

10 Oct 2025 | Friday | NEWS
Smartkem, Inc. Signs LOI with Jericho Energy Ventures to Build U.S. AI Infrastructure Using Organic Semiconductor Technology

Smartkem, Inc. (Nasdaq: SMTK), ("Smartkem"), a company developing a new class of organic semiconductor technology, announced that it has signed a non-binding Letter of Intent ("LOI") with Jericho Energy Ventures Inc. (TSX-V: JEV, OTC: JROOF) ("Jericho" or "JEV"), an energy innovation company, for a proposed all-stock business combination (the "Proposed Transaction"). If completed, the Proposed T...

10 Oct 2025 | Friday | NEWS
Ansys SimAI Empowers Sumitomo Riko to Transform Multiphysics Simulation with 10x Faster Predictions

Ansys SimAI helps engineers swiftly predict physics-based behavior — including mechanical, thermal, and chemical — across product design and manufacturing / Key Highlights Part of the Synopsys portfolio of simulation & analysis solutions, the Ansys SimAI™ platform enables Sumitomo Riko to accelerate simulation speed over 10x when compared to traditional simul...

10 Oct 2025 | Friday | NEWS
Quilter Raises $25 Million from Index Ventures to Revolutionise Hardware Design with Physics-Driven AI

Index Ventures backs Quilter to automate circuit board design, a trillion-dollar bottleneck found in everything from phones to fighter jets. Quilter, the first and only company to publicly demonstrate fully autonomous PCB layout through physics-driven AI, announced $25 million in Series B funding led by Index Ventures. The investment comes as Fortune 500 aerospace, defense, and consum...

9 Oct 2025 | Thursday | NEWS
Pegatron 5G Selects MaxLinear’s Sierra Radio SoC for Next-Generation 5G Macro Open RAN Radio Unit

MaxLinear, Inc. (Nasdaq: MXL), a leading provider of wireless infrastructure solutions, today announced that Pegatron 5G has selected Sierra, the company’s single-chip Radio SoC, for their next generation PR2850 5G Macro Open RAN Radio Unit (O-RU). Pegatron is a global technology leader focusing on O-RAN-compliant solutions. The PR2850 is Pegatron 5G’s latest carrier-grade 5G Macro ...

9 Oct 2025 | Thursday | NEWS
NTT Research, Cornell, and Stanford Unveil World’s First Programmable Nonlinear Photonic Waveguide

Demonstration enables new applications for tunable light sources, optical and quantum computations, and communication infrastructure Highlights: New paper published in Nature details NTT Research’s development of the world’s first programmable nonlinear photonic waveguide in collaboration with Cornell University and Stanford University. A single chip of the developed device su...

9 Oct 2025 | Thursday | NEWS
HAP International Advances Toward Agreement with U.S. Customs for TRACE ID Supply Chain Traceability Program

HAP International announced  that following a successful technical assessment of the quality and scope of shipment-level traceability data provided by the TRACE ID program, they are taking steps toward a formal Memorandum of Agreement with U.S. Customs and Border Protection (CBP). The initiative builds on CBP’s ongoing Global Business Identifier (GBI) test and reflects the agency&rsqu...

8 Oct 2025 | Wednesday | NEWS
Amkor Expands $7 Billion Advanced Packaging & Test Campus in Arizona

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration,  announces the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced packaging and test campus in Arizona. The expanded investment includes additional cleanroom space and a second green...

7 Oct 2025 | Tuesday | NEWS
India’s Semiconductor Revolution Finds Its Backbone in Materials Science

As India’s semiconductor aspirations gather pace, the spotlight is gradually shifting from fabrication plants to the unsung enablers of the chipmaking process — the materials that make every connection possible. From bonding wires and solder pastes to fluxes and adhesives, global materials manufacturers are homing in on India, viewing it as a future hub not just for chip assembly, b...

6 Oct 2025 | Monday | NEWS
PINC Technologies Raises $6.8M to Scale Nonlinear Photonics for Quantum and Industrial Applications

PINC Technologies, a Caltech spinout company developing advanced integrated nonlinear photonic devices and circuits, announced the close of its Seed+ round, bringing total funds raised to date to $6.8M. The funding will accelerate commercialization of the company’s technology, which builds on groundbreaking research from the Caltech Nonlinear Photonics Laboratory. The latest round was led ...

3 Oct 2025 | Friday | NEWS
QuickLogic Wins eFPGA Hard IP Contract for 12 nm Data Center ASIC

QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened, Antifuse and ruggedized FPGAs, announced  that its eFPGA Hard IP was selected for a new high-performance Data Center ASIC design that will be fabricated on an industry-proven 12 nm process technology. IP delivery for this contract is scheduled for Q4 2025. "We are excited...

3 Oct 2025 | Friday | NEWS