LG Chem Targets AI Semiconductor Growth with Advanced Packaging Materials at SEMICON Taiwan 2026
New solutions for HBM, advanced substrates, bonding and thermal management aim to address the rising material demands of AI chip packaging.
LG Chem is set to showcase a broad portfolio of advanced packaging and power semiconductor materials for AI applications at SEMICON Taiwan 2026, as the South Korean chemical company seeks to strengthen partnerships with semiconductor manufacturers, OSAT providers and substrate companies. The exhibition will take place from 2–4 September at the Taipei Nangang Exhibition Centre.
At the event, LG Chem will present materials designed for high-bandwidth memory (HBM) and next-generation AI semiconductor packaging. Its advanced packaging portfolio will include copper-clad laminates, glass core materials, build-up films, film-type solder resists, photosensitive insulating materials, die-attach films, as well as bonding, debonding and stripping solutions. The company is positioning these technologies to address the increasing packaging complexity created by AI and high-performance computing applications.
LG Chem will also highlight materials aimed at improving the performance and thermal management of power semiconductors used in AI data centres. These include conductive sintering pastes, thermal interface materials and thermal management solutions based on copper metal foam, which are designed to improve heat dissipation and support efficient operation in high-power semiconductor systems.
The company's participation comes as advanced packaging becomes increasingly important for AI semiconductor development. Higher computing performance and growing HBM requirements are placing greater demands on substrates, interconnects, insulation, bonding and thermal-management materials. LG Chem's portfolio is intended to address these requirements across different stages of semiconductor packaging and manufacturing.
SEMICON Taiwan will also give LG Chem an opportunity to deepen relationships within Taiwan's semiconductor ecosystem. The event brings together chipmakers, OSAT companies, substrate manufacturers and other industry suppliers, providing a platform for technology discussions and potential business partnerships. LG Chem is seeking to expand its presence in the semiconductor materials market as AI infrastructure investment continues to drive demand for advanced packaging technologies.
