Rapidus Expands Semiconductor Capabilities with Launch of Analysis Centre and Chiplet R&D Hub
New facilities in Hokkaido strengthen advanced testing, packaging, and development ahead of 2027 mass production targets
Rapidus Corporation announced that it opened an Analysis Centre and its Rapidus Chiplet Solutions (RCS).
The Analysis Centre is a facility adjacent to Rapidus' Innovative Integration for Manufacturing (IIM-1) semiconductor foundry in Chitose, Hokkaido. It conducts the physical analysis, environmental and chemical analysis, electrical characterisation, and reliability testing necessary for the development of cutting-edge logic semiconductors.
RCS began setting up operations in October 2024 at the Seiko Epson Corporation Chitose Plant, located near IIM-1, to serve as a post-production R&D hub for advanced semiconductor packaging. Following the completion of the cleanroom, Rapidus began installing equipment in April 2025 and has been operating at a limited capacity—including the production of a prototype 600mm square RDL interposer panel. RCS will now start full-scale operations.
An opening ceremony was held on April 11 to commemorate these new facilities. The ceremony was attended by Japan's Minister of Economy, Trade and Industry, Akazawa Ryosei, Hokkaido Governor Suzuki Naomichi and Chitose Mayor Yokota Ryuichi. Following congratulatory remarks, a ribbon-cutting ceremony was conducted with the participation of members of the Diet representing Hokkaido.
With the opening of the Analysis Centre and RCS, Rapidus aims to further enhance its development environment and steadily advance toward mass production of cutting-edge semiconductors in the second half of fiscal year 2027.
