Panmnesia and Openchip Sign AI Infrastructure Collaboration MOU at Mobile World Congress 2026

Panmnesia, a provider of advanced link solutions, announced that it has signed a Memorandum of Understanding (MOU) with Openchip, a European AI accelerator design company, at MWC26 in Barcelona. The agreement focuses on technical collaboration related to AI/HPC infrastructure.

The agreement marks a step toward technical collaboration aimed at enhancing performance, scalability, and resource efficiency in AI accelerator and infrastructure environments. The two companies exchanged in-depth technical perspectives on link architecture design and system optimization approaches for AI/HPC systems.

As large-scale AI models continue to proliferate, efficient utilization of accelerator resources and high-performance connectivity within data centers have emerged as key competitive factors. In particular, standards-based link technologies that seamlessly connect AI accelerators and infrastructure resources are rapidly gaining industry attention. Under the agreement, the companies are going to explore collaboration opportunities across various link standards and system architecture configurations.

■ Executive Quotes

Myoungsoo Jung, CEO of Panmnesia, said, “As AI accelerator and infrastructure environments evolve rapidly, link technologies are becoming increasingly critical to overall system performance. Through global partnerships, Panmnesia will continue to advance next-generation link technologies for AI infrastructure.”

Cesc Guim, CEO of Openchip, said, “This collaboration is essential for building a scalable and efficient AI infrastructure in the global tech landscape. In our mission to strengthen digital sovereignty through open-standard, high-performance silicon, by combining RISC-V accelerators with Panmnesia’s advanced link technologies, we are tackling the data movement bottlenecks that define the next generation of AI and computing.”