THine Announces Optical DSP-Free Chipset for PCIe6 and PCIe7

THine Electronics, Inc. (Tokyo Stock Exchange:6769, “THine”), a global leading fabless semiconductor supplier of innovative mixed signal LSI and analog technologies as well as valuable AI/IoT-based solutions and AI/data servers, announced its optical DSP(digital signal processor)-free chipset with its ZERO EYE SKEW^® technology for short-reach optical interconnect of PCI Express7(PCIe7) 2TB/s linear pluggable optics(LPO) or co-packaged optics(CPO), enabling to save power by 73% and lower latency by 90%. THine plans to deliver its optical DSP-free chipset samples of vertical-cavity surface-emitting lasers(VCSEL) driver and transimpedance amplifier(TIA) for PCIe7 in 2027 and samples for PCIe6 in 2026, as well as its “Sideband Aggregator” IC samples in 2026.

These VCSEL drivers and TIAs are developed with support from the grant program (No.JPJ012368G70601) by the National Institute of Information and Communications Technology(NICT), Japan.

THine has developed its ZERO EYE SKEW^® technology for PCIe6/7 for “slow and wide” interconnections in scale-up AI networks that enable the elimination of optical DSP from optical links, achieving a cost-effective, lower latency, high-density, and power-efficient short-reach solution of the next-generation.

Many optical interconnects, including PCIe6/7, have several GPIO lines, called “sideband”, and THine’s new solution, “Sideband Aggregator” IC (THCS255), enables reducing such GPIO lines to half or less, empowered by its high-speed serial technology.

THine will exhibit such a solution at the 2026 Optical Fibre Communications Conference and Exhibition (OFC2026) at the Los Angeles Convention Centre in Los Angeles, California, March 17^th ~ 19^th, at West Hall 4575.

“The adoption of artificial intelligence(AI) is rapidly expanding. Since AI servers are going to be equipped with over 500 GPUs and memories, we are confident that THine’s proprietary ZERO EYE SKEW^® technology, eliminating DSPs from optical links in Scale-Up AI networks, delivers significant value of efficient costs, lower latency, high-density, and lower power,” said Yasuhiro Takada, Chief Strategy Officer of THine Electronics, Inc. “THine plans to accelerate product development and to contribute to ‘slow and wide’ optical interconnection through collaboration and cooperation with major global customers, hyperscalers, and partners.”