• Sunday | 08 February 2026
Open Compute Project Advances Silicon Diversity with New Universal D2D Transaction and Link-Layer Spec Covering UCIe

The Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, announces it has taken important steps in enabling silicon diversity for high-performance AI and HPC Clusters with the release of a new Universal D2D Transaction and Link-Layer specification that now also covers UCIe. This universal link layer will be an important part of the e...

28 Sep 2025 | Sunday | NEWS
Cyient Semiconductors and GlobalFoundries Forge Strategic Channel Partnership to Accelerate Custom Silicon Innovation

Cyient Semiconductors Private Limited, a fast-growing custom silicon company, announced a strategic Channel Partner Agreement with GlobalFoundries (GF), one of the world's leading pure-play semiconductor foundries. Under the agreement, Cyient Semiconductors becomes an authorized reseller of GF's semiconductor manufacturing services and technologies. This collaboration is a significant step towa...

28 Sep 2025 | Sunday | NEWS
Marvell Unveils Industry’s First 2nm 64 Gbps Bi-Directional D2D Interconnect for Next-Gen XPUs

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced the industry's first 2nm 64 Gbps bi-directional die-to-die (D2D) interconnect, enabling chip designers to significantly boost the bandwidth and performance of next-generation XPUs while reducing power and silicon area. Delivering 32 Gbps of simultaneous two-way connectivity over a single wire, the interf...

28 Sep 2025 | Sunday | NEWS
Morse Micro and Browan Communications Partner to Accelerate Global Adoption of Wi-Fi HaLow for IoT 2.0

The Things Conference – Morse Micro, the world's leading provider of Wi-Fi HaLow silicon solutions, announced a new technology partnership with Browan Communications to accelerate the adoption of Wi-Fi HaLow™ worldwide. Together, the companies will grow the Wi-Fi HaLow ecosystem and bring the next generation of Internet of Things (IoT) products to market at scale. With a focus on t...

27 Sep 2025 | Saturday | NEWS
Marvell to Showcase Cutting-Edge Interconnect Solutions for AI Data Centers at ECOC 2025

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced it will showcase its extensive, industry-leading interconnect portfolio for scale-up and scale-out data center AI deployments at the European Conference on Optical Communication (ECOC), September 28 to October 2 in Copenhagen, Denmark. The rapid evolution of generative AI technologies and larg...

27 Sep 2025 | Saturday | NEWS

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