• Thursday | 26 March 2026
Baya Systems Honored with 2025 Global Technology Innovation Leadership Recognition by Frost & Sullivan

Frost & Sullivan is pleased to announce that Baya Systems has been recognized with the 2025 Global Technology Innovation Leadership Recognition in the semiconductor IP interconnect solutions industry for its outstanding achievements in product innovation, strategic execution, and customer impact. This recognition highlights Baya Systems' consistent leadership in driving measurable ...

28 Sep 2025 | Sunday | NEWS
Open Compute Project Advances Silicon Diversity with New Universal D2D Transaction and Link-Layer Spec Covering UCIe

The Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, announces it has taken important steps in enabling silicon diversity for high-performance AI and HPC Clusters with the release of a new Universal D2D Transaction and Link-Layer specification that now also covers UCIe. This universal link layer will be an important part of the e...

28 Sep 2025 | Sunday | NEWS
Cyient Semiconductors and GlobalFoundries Forge Strategic Channel Partnership to Accelerate Custom Silicon Innovation

Cyient Semiconductors Private Limited, a fast-growing custom silicon company, announced a strategic Channel Partner Agreement with GlobalFoundries (GF), one of the world's leading pure-play semiconductor foundries. Under the agreement, Cyient Semiconductors becomes an authorized reseller of GF's semiconductor manufacturing services and technologies. This collaboration is a significant step towa...

28 Sep 2025 | Sunday | NEWS
Marvell Unveils Industry’s First 2nm 64 Gbps Bi-Directional D2D Interconnect for Next-Gen XPUs

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced the industry's first 2nm 64 Gbps bi-directional die-to-die (D2D) interconnect, enabling chip designers to significantly boost the bandwidth and performance of next-generation XPUs while reducing power and silicon area. Delivering 32 Gbps of simultaneous two-way connectivity over a single wire, the interf...

28 Sep 2025 | Sunday | NEWS
Morse Micro and Browan Communications Partner to Accelerate Global Adoption of Wi-Fi HaLow for IoT 2.0

The Things Conference – Morse Micro, the world's leading provider of Wi-Fi HaLow silicon solutions, announced a new technology partnership with Browan Communications to accelerate the adoption of Wi-Fi HaLow™ worldwide. Together, the companies will grow the Wi-Fi HaLow ecosystem and bring the next generation of Internet of Things (IoT) products to market at scale. With a focus on t...

27 Sep 2025 | Saturday | NEWS
Marvell to Showcase Cutting-Edge Interconnect Solutions for AI Data Centers at ECOC 2025

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced it will showcase its extensive, industry-leading interconnect portfolio for scale-up and scale-out data center AI deployments at the European Conference on Optical Communication (ECOC), September 28 to October 2 in Copenhagen, Denmark. The rapid evolution of generative AI technologies and larg...

27 Sep 2025 | Saturday | NEWS

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