• Monday | 21 September 2026
TDK Corporation and Nippon Chemical Industrial Begin Discussions on Joint Venture for Advanced Electronic Component Materials

TDK Corporation and Nippon Chemical Industrial Co., Ltd. have announced the signing of an agreement to begin formal discussions toward establishing a joint venture dedicated to next generation electronic component materials. The proposed venture would focus on the co development and manufacturing of ceramic materials for multilayer capacitors as well as other high value materials essential to se...

28 Nov 2025 | Friday | NEWS
PowerLattice Emerges from Stealth with $25M to Revolutionize Power Delivery for Next-Gen AI Accelerators

PowerLattice, the company reimagining power delivery for next-generation AI accelerators, announced its emergence from stealth with $25 million in Series A funding jointly led by Playground Global and Celesta Capital. The company’s breakthrough power delivery chiplet tightly couples power and compute, reducing total compute power needs by more than 50%, effectively doubling performance. Powe...

18 Nov 2025 | Tuesday | NEWS
Hummink is Redefining Microelectronics Manufacturing with Ultra-Precise Printing Technology

Hummink is redefining how the world’s smallest technologies are made, using ultra-precise printing to fix microscopic flaws and power the next generation of chips and displays.   As microelectronics underpin the rise of artificial intelligence and high-performance computing, the smallest manufacturing imperfections have become billion-euro problems. Each defect at the sub-micron scale...

18 Nov 2025 | Tuesday | NEWS
United Micro Integrates Ceva’s PentaG Lite 5G Platform in RedCap SoC for Automotive

United Micro integrates Ceva-PentaG Lite 5G platform IP in RedCap SoC, delivering cost–efficient, secure, and scalable connectivity for next–generation vehicles As automakers expand connected vehicle offerings, 5G RedCap is emerging as a cost–efficient complement to traditional 5G, enabling mass–market adoption of vehicle connectivity without compromi...

12 Nov 2025 | Wednesday | NEWS
Supplyframe and Orbweaver Partner to Streamline Data Connectivity Across the Electronics Supply Chain

-Supplyframe and Orbweaver  announced a new strategic collaboration that addresses one of the most pressing challenges facing electronics manufacturers and distributors: the need to harmonize and connect critical data across design, sourcing, and commercial systems. Through this partnership, Supplyframe’s Design-to-Source Intelligence (DSI) platform and SaaS solutions including NPI, ...

11 Nov 2025 | Tuesday | NEWS
SEMI Reports Continued Strength in Advanced Node Wafer Demand as Global Shipments Increase Year-on-Year

Growth in 300 mm Shipments Fueled by AI to Support Advanced Logic, Cloud Computing and Memory Applications  The SEMI Silicon Manufacturers Group (SMG) reported , in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 3.1% year-on-year to 3,313 million square inches (MSI) from the 3,214 MSI recorded during the same quarter of 2024. Sequent...

6 Nov 2025 | Thursday | Analysis
Renesas Expands RA8 Series with 1 GHz Cortex-M85 MCUs for AI, Industrial and Graphics-Driven Applications

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, introduced the RA8M2 and RA8D2 microcontroller (MCU) groups. Based on a 1 GHz Arm® Cortex®-M85 processor with an optional 250 MHz Arm®Cortex®-M33 processor, the new MCUs are the latest Renesas offerings to deliver an unmatched 7300 Coremarks of raw compute performance, the industry...

23 Oct 2025 | Thursday | NEWS
International Battery Metals Secures USD $2 Million Follow-On Investment from EV Metals

International Battery Metals Ltd.(“IBAT”) (TSXV: IBAT) & (OTCQB: IBATF), an advanced technology provider of modular direct lithium extraction (DLE) systems,  announced a non-brokered private placement financing, marking the second follow-on investment under the Company’s previously announced binding Letter of Intent (“LOI”) with EV Metals 7 LLC (“EV M...

23 Oct 2025 | Thursday | NEWS
ShunYun Technology and NewPhotonics Forge Strategic OSAT Partnership to Accelerate High-Volume PIC Manufacturing

ShunYun Technology Ltd (SYT), a world-class manufacturer of optical transceivers, and NewPhotonics, a leading designer of highly integrated photonic integrated circuit (PIC) chips for data center optical interconnect, today announced a strategic OSAT partnership for volume manufacturing of the NewPhotonics NPG product line. Ethernet pluggable optics are forecasted to scale to >100 million by...

1 Oct 2025 | Wednesday | NEWS
Open Compute Project Advances Silicon Diversity with New Universal D2D Transaction and Link-Layer Spec Covering UCIe

The Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, announces it has taken important steps in enabling silicon diversity for high-performance AI and HPC Clusters with the release of a new Universal D2D Transaction and Link-Layer specification that now also covers UCIe. This universal link layer will be an important part of the e...

28 Sep 2025 | Sunday | NEWS
PI Introduces High-Precision Air Bearing Linear Slides for Frictionless Motion and Sub-Micron Accuracy

PI (Physik Instrumente), a global leader in precision motion and positioning solutions, offers standard and custom air bearing linear slides. Based on decades of experience from PI's USA engineering and manufacturing teams, these air bearings are designed for applications requiring ultra-smooth, zero stick-slip linear motion and sub-micron straightness and flatness.   Frictionless Performa...

28 Sep 2025 | Sunday | NEWS
d-Matrix Unveils JetStream™ I/O Card to Power Ultra-Low Latency, Scalable AI Inference at Data Center Scale

d-Matrix® announced the expansion of its AI product portfolio with d-Matrix JetStream™, a custom I/O card designed from the ground up to deliver industry-leading, data center–scale AI inference. With millions of people now using AI services – and the rise of agentic AI, reasoning, and multi-modal interactive content – the industry's focus is quickly shifting fro...

27 Sep 2025 | Saturday | NEWS
Lam Research and JSR/Inpria Form Strategic Collaboration to Accelerate Next-Gen Semiconductor Patterning

Lam Research Corp. a global leader in semiconductor fabrication equipment and services, and JSR Corporation, a leading technology company focused on materials innovation solutions and the parent company of Inpria Corporation, a metal oxide photoresist solution provider, today announced that Lam and JSR/Inpria have entered into a non-exclusive cross-licensing and collaboration...

27 Sep 2025 | Saturday | NEWS

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