Qnity Electronics, Inc. Wins 2025 ASE Best Supplier Award for Advanced Packaging Materials
Recognition from ASE Technology Holding Co., Ltd. highlights Qnity’s role in supporting next-generation AI and data centre semiconductor packaging through its silicone-based thermal interface and lid seal material technologies.
Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced it received the 2025 ASE Best Supplier Award from ASE Technology Holding Co., Ltd., one of the world’s largest outsourced semiconductor assembly and test providers (OSATs), headquartered in Taiwan, for its silicone-based materials. An honor bestowed on ASE partners, the annual award recognises those who provide outstanding performance in materials, equipment and services.
An industry leader in advanced packaging materials, including its silicone-based lid seal and TIM1 materials portfolio, Qnity offers a broad and integrated portfolio of material innovations across the packaging value chain —from CMP and circuit metallization to thermal interface and lid seal materials. Through this portfolio, Qnity collaborates with leading OSATs to enable high-volume manufacturing and next-generation technology development.
A long-standing partner of ASE, Qnity’s silicone-based lid seal and TIM1 materials have played a critical role in ASE’s FCBGA (Flip Chip-Ball Grid Array) and advanced packaging applications. Through close collaboration with ASE’s site teams, Qnity has routinely supported day-to-day production requirements and enabled successful ramp‑ups for new project launches from early sampling and material evaluation through qualification and final adoption.
“The move to 3D architectures and advanced packaging is raising the bar for performance, reliability, and manufacturability across the industry,” said Chuck Xu, President, Interconnect Solutions at Qnity. “ASE’s recognition highlights the role our materials play in enabling next-generation semiconductor packaging.”
Designed to withstand the highly stressful operating environments of today’s advanced semiconductor devices, Qnity’s silicone materials support the advanced packaging technologies that enable the most complex chips for AI and data center applications.
