Suchi Semicon Launches New QFN Series, Expands Power-Packaging Portfolio to Boost India’s OSAT Capabilities
Launch of advanced semiconductor-packaging platforms boosts India’s self-reliance and expands Gujarat’s role in the emerging chip-manufacturing ecosystem.
Suchi Semicon, one of India’s emerging semiconductor-backend manufacturers, announced the launch of its new QFN (Quad Flat No-Lead) package series and an expanded advanced power-package portfolio, marking a significant milestone in the country’s semiconductor-packaging capabilities.
The new lineup strengthens India’s domestic OSAT (Outsourced Semiconductor Assembly and Test) ecosystem at a time of rising demand for locally packaged chips across electric vehicles (EVs), industrial electronics, consumer devices, and IoT applications. The expansion advances India’s broader mission to reduce its dependence on overseas backend services—particularly in high-growth sectors requiring compact, thermally efficient packaging technologies.
Strengthening Domestic Manufacturing
Suchi Semicon’s newly introduced QFN series enables customers to access compact, high-performance, and cost-efficient package options designed for next-generation electronics. Complementing this, the company’s advanced power-package lineup is tailored for high-current and high-thermal-dissipation requirements, supporting the growing domestic need for power devices used in EV powertrains, chargers, energy-storage systems, and industrial automation.
“With this expansion, we are positioning India to move further up the semiconductor value chain,” said spokesperson Suchi Semicon. “Our goal is to deliver globally competitive packaging technologies from within India, while offering our customers faster turnaround, greater supply-chain resilience, and a strong alternative to overseas OSAT dependencies.”
Supporting Regional Ecosystem Growth
Located in Gujarat—home to several new semiconductor and electronics investments—Suchi Semicon’s expansion aligns with India’s push to build a geographically diversified and globally competitive chip ecosystem. The company plans to extend its customer engagement programs, offer joint development opportunities for customized package designs, and establish partnerships with fabless semiconductor companies in India and abroad.
