SonicEdge Partners with Global Semiconductor Manufacturer to Integrate Modulated Ultrasound into Audio Chipsets
Silicon-level integration accelerates the adoption of next-generation audio for AI hearables and wearables
SonicEdge, a pioneer in micro-acoustic innovation, announced at CES 2026 a new strategic partnership with a leading global semiconductor manufacturer to integrate its modulated ultrasound IP directly into next-generation audio chipsets. The audio chipset will natively drive SonicEdge’s modulated ultrasound speakers. Additional major chip companies are expected to follow as the industry recognises modulated ultrasound as the enabling technology for AI-powered hearables and wearables.
Semiconductor-Level Integration Accelerates Market Adoption
This new strategic partnership with a leading global semiconductor manufacturer represents a significant milestone in modulated ultrasound technology adoption. By embedding SonicEdge IP at the silicon level, chip manufacturers can deliver native support for modulated ultrasound speakers, eliminating integration barriers for OEMs and establishing a new benchmark for audio performance in space-constrained devices.
"Chip manufacturers today understand that AI-enabled hearables demand a fundamentally different acoustic architecture," said Dr Moti Margalit, CEO and Co-founder of SonicEdge. "Modulated ultrasound delivers the performance, miniaturisation, and power efficiency these devices require, and we're seeing rapid industry movement to adopt this technology."
Commercial Momentum and Product Development
Backed by over 25 patents and proven commercial integrations, SonicEdge is establishing modulated ultrasound as the foundational technology for next-generation audio devices. SonicEdge's core products are currently in active integration programs with key customers across several hearables and wearables applications. The company is also developing next-generation integrated solutions, including the SonicTwin 100 (ST100) platform, which combines modulated ultrasound drivers with advanced microphone technology to enable breakthrough performance in active noise control and ultra-low-latency audio processing for AI-powered devices.
