Nordson Launches ASYMTEK Vantage XL for High-Precision Panel-Level Packaging
New fluid dispensing platform targets AI and automotive semiconductor packaging with improved warpage control, thermal management, alignment and production throughput.
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, introduces the new ASYMTEK Vantage® XL fluid dispensing platform, designed specifically to address the demanding requirements of panel-level packaging (PLP) and other advanced semiconductor packaging applications.
The ASYMTEK Vantage XL extends Nordson's proven Vantage dispensing platform to larger panel formats, enabling manufacturers to develop next-generation advanced packaging processes and scale production with greater accuracy, throughput, and process control.
Panel-level packaging (PLP) enables higher throughput and lower manufacturing costs compared to wafer-level operations, especially as package sizes grow and throughput demands accelerate for artificial intelligence (AI) applications and automotive electrification. However, scaling large-format panels introduces challenges including warpage control, thermal management, and dispensing accuracy, all of which require specialised process controls.
Designed specifically to address these challenges in PLP, the ASYMTEK Vantage XL Fluid Dispensing System delivers:
- Improved dispensed underfill flow and warpage mitigation for void-free results.
- Flexible tooling support for large panel sizes during semiconductor manufacturing.
- Integrated thermal management for rapid heating and temperature uniformity across the substrate.
- Multi-fiducial capture for fast, accurate alignment.
- Confocal height sensing for reflective and transparent glass panels.
- Post-dispense inspection for efficient and process rework.
- Based upon the popular Vantage dispensing system, in a larger platform frame to accommodate common panel sizes.
The new ASYMTEK Vantage XL fluid dispensing system will be on display during SEMICON Taiwan 2026, booth #I2308. In addition, Nordson will highlight the new MARCH ExoSPHERE™ plasma treatment system, which supports advanced packaging processes by providing uniform surface preparation for panels and wafers.
