Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, announced a family of compact, high-efficiency platforms powered by AMD EPYC™ 4005 series processors. The edge-optimised systems are designed to accelerate AI inferencing and general-purpose workloads in space and power-constrained environments, including retail, manufacturing...
As artificial intelligence, robotics, automation, and advanced computing continue to push demand for semiconductors to new heights, the pressure to expand manufacturing capacity has become one of the most urgent challenges facing the global chip industry. The bottleneck is not simply building new fabs. It requires getting the facility, tools, infrastructure, and processes right from the start...
At CMEF 2026, VITAL MedTech, the healthcare unit of VITAL MATERIALS, unveiled a full range of innovations based on its semiconductor core technologies. It demonstrated its full vertical integration across core materials, chips, and medical systems. Technology Breakthrough: Mastering Core Components Development Technology Global medical imaging technology is transitioning from digitalisation...
Specs Inc., a Snap subsidiary, and Qualcomm Technologies, Inc. announced a multi-year strategic agreement to power future generations of Specs with Qualcomm Technologies’ industry-leading Snapdragon system-on-a-chip (SoC). This is the first flagship engagement for Specs Inc., which is launching Specs, advanced eyewear that seamlessly integrates digital experiences into the physical wor...
BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, BCHPY), the world’s first commercial producer of ultra-low-power, neuromorphic AI technology, announced the launch of its Radar Reference Platform. This fully validated hardware and AI stack is designed to provide real-time object classification at the edge, solving the critical "identification gap" that limits traditional radar ...
Intel Corporation (NASDAQ: INTC) and Google announced a multiyear collaboration to advance the next generation of AI and cloud infrastructure, reinforcing the critical role of CPUs and custom infrastructure processing units (IPUs) in scaling modern, heterogeneous AI systems. As AI adoption accelerates, infrastructure is becoming more complex and heterogeneous, driving increased reliance on CPUs f...
Semidynamics, an advanced computing company developing memory-centric AI infrastructure for large-scale inference, announced a strategic investment from SK hynix, one of the world's leading memory manufacturers. The investment reflects a shared conviction that memory architecture, not compute alone, will define the economics of next-generation AI inference, where cost per token is the me...
Kinetic Technologies (Kinetic) announced that it has completed the necessary steps to enter into an agreement under which Cyient Semiconductors has secured a majority stake in Kinetic for a total consideration of $85 million USD. The strategic investment marks a significant step in accelerating research and product development, while strengthening Kinetic's ability to serve global c...
SambaNova announced the next phase of its collaboration with Intel: a heterogeneous hardware solution that combines GPUs for prefill, Intel Xeon® 6 processors as both host and “action” CPUs, and SambaNova RDUs for decode to deliver premium inference for the most demanding Agentic AI applications. The design will be made available in H2 2026 to enterprises, cloud providers, and...
Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, announced the first 2026 instalment of its Empowering Innovation Together (EIT) technology series, Engineering AI for Daily Life. This installment explores how artificial intelligence is increasingly embedded in everyday products and services, from as...
Bureau Veritas, a global leader in Testing, Inspection, and Certification services (TIC), announces that it has signed an agreement to acquire Lotusworks, a global leader in mission‑critical assets commissioning and quality assurance and control. This strategic move will uniquely position the Buildings & Infrastructure Product Line to benefit from AI-driven construction investments. Headqua...
Roundhill Investments, an ETF sponsor focused on innovative financial products, announced the launch of the Roundhill Memory ETF (Ticker: DRAM). DRAM seeks to provide investors with targeted exposure to global companies operating within the memory segment of the semiconductor industry, including manufacturers of DRAM, High-Bandwidth Memory (HBM), NAND flash, and solid-state storage devices (SSD)....
L Squared Capital Partners (“L Squared”) is pleased to announce the successful closing of a single-asset continuation fund for BTX Precision (“BTX” or the “Company”), a leading high-precision manufacturer of mission-critical components and assemblies. The platform’s unmatched breadth of additive and subtractive manufacturing capabilities – including ...
Corning and Meta have commenced construction on an expanded cable manufacturing facility in North Carolina to support the growing demand for artificial intelligence (AI) infrastructure. The project is part of a broader multi-year partnership between the two companies, under which Corning will provide advanced optical fibre, cable and connectivity solutions for Meta’s data centres. The agree...
As the United States races to secure its semiconductor future, Last Mile Education Fund announces that the AMD Foundation has joined its Semiconductor Pathways Fund with a $500,000 philanthropic investment over the next three years. The Semiconductor Pathways Fund is a national industry coalition ensuring that the engineers and technicians already enrolled in STEM programs...
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc, marking a major milestone in Molex's vision to enable technology that is transforming the future and improving people's lives. Smiths Interconnect brings a diverse portfolio of complementary products and advantaged capabilities ...
At OFC 2026, the Innovative Optical and Wireless Network Global Forum (IOWN Global Forum), comprised of over 180 member organisations, highlighted its vision for the future of open AI networking through an interactive booth and dedicated panel session. These platforms enabled the Forum to demonstrate the power of interoperable technologies and engage industry leaders on how collabor...
OMNIVISION, a leading global developer of semiconductor technology, including advanced digital imaging, analog, and display solutions, and ATL Medical, Inc., a designer, developer and manufacturer of innovative medical devices, announced that ATL is using the OVMed® OH0131 image signal processor (ISP) in its PREVOYANCE® Complete Imaging System with Chip-on-Tip® technolog...
MacroValor Corporation and Favis Advanced Robotics announced plans for Mount Hydrogen, a 3,000-megawatt AI, robotics, and semiconductor mega campus to be developed in Austin, Texas. The facility will draw exclusively on MacroValor's natural hydrogen energy network to power continuous, zero-emission operations at a scale no The announcement comes as American technology companies face a conver...
Pacific Defence announced the launch of the DSP3100VP, a next-generation digital signal processing module engineered to bring advanced artificial intelligence and machine learning (AI/ML) capabilities to the edge. Built on the AMD Versal™ AI Edge Series Gen 2 adaptive SoC, the DSP3100VP combines heterogeneous compute, adaptive acceleration, and deterministic real-time control to meet th...