Cognite, the global leader in Industrial AI, announced the official grand opening of its new global headquarters in Tempe, Arizona. The relocation from Oslo, Norway marks a milestone in the company's growth strategy and underscores its commitment to the North American market. "Establishing our global headquarters in Arizona represents an exciting new chapter for Cognite as this positions ...
Wizerr AI today introduced the Agentic BOM Engine, powered by Wizerr’s patent-pending component intelligence engine (ELX). ELX reads and interprets complex component datasheets with engineer-level precision and scales that capability to millions of components, turning unstructured documents into AI-transformed, reasoning-ready data for multi-agent workflows across the electronics manufactu...
-Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced its AOLV66935 a 100V High Safe Operating Area (SOA) MOSFET in an LFPAK 8x8 package. AOS’ latest MOSFET is designed as an ideal solution for 48V Hot Swap architectur...
Celestial AI’s breakthrough Photonic FabricTM technology platform enables optical I/O for package, system and rack-level connectivity for the next-generation of data center infrastructure Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced it has entered into a definitive agreement to acquire Celestial AI, a pioneer of a disruptive ...
-Kioxia America, Inc. announced a collaboration between Kioxia Corporation, Tsubakimoto Chain Co. (Tsubakimoto Chain) and EAGLYS Inc. (EAGLYS) to develop AI-driven image recognition technology that automatically identifies products moving through logistics workflows. This system supports advanced automation and efficiency in logistics, enabling organizations to respond quickly to changing...
Samsung Electronics and SK Hynix, the world’s leading memory chip manufacturers, are set to benefit from a significant surge in global demand for high-bandwidth memory (HBM), driven by the rapid expansion of artificial intelligence workloads and Google’s latest deployment of its advanced Tensor Processing Units (TPUs). As hyperscalers and cloud service providers scale up infrastruct...
Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM), the world’s leading semiconductor foundry, cautioned that its production capacity at advanced process nodes remains significantly below what is required to support the rapid acceleration of global artificial intelligence (AI) workloads. Speaking at a recent industry briefing, TSMC’s Chief Executive Officer stated th...
Micron Technology, Inc., a global leader in memory and storage solutions, today announced plans to invest $9.6 billion in the construction of a new advanced semiconductor fabrication facility in Hiroshima, Japan. The new plant will focus on producing next-generation high-bandwidth memory (HBM) chips designed to power the world’s rapidly expanding artificial intelligence (AI) and high-perfo...
The global Electronic Design Automation (EDA) Market continues its robust expansion, propelled by accelerating semiconductor innovation, growing adoption of advanced electronics across industries, and increasing design complexity requiring automated, high-precision tools. According to the latest industry analysis, the market was valued at USD 541 million in 2023 and is projected to grow to USD 8...
IFS, the leading provider of Industrial AI software, and Boston Dynamics, the global leader in mobile robotics, announced a ground-breaking collaboration to revolutionize how asset-intensive organizations manage and optimize their field operations. Uniting Boston Dynamics' autonomous inspection robots with the power of IFS.ai creates a fully agentic AI system that seamlessly connects...
In a ribbon-cutting event at its campus in Tualatin, OR, Lam Research Corp. (NASDAQ: LRCX) commemorated the opening of its new, $65 million office building, joined by Oregon State Senate President Robert Wagner, representatives from the offices of Oregon Governor Tina Kotek and Oregon Congresswoman Andrea Salinas, and other distinguished local government, community, business, philanth...
Expanded partnership includes deployment of up to 150,000 AI accelerators including the latest NVIDIA GB300s AI infrastructure and AWS’s Trainium chips. Amazon Bedrock will provide customers access to best-in-class foundation models optimized across diverse, high performance AI chip infrastructures. AWS becomes HUMAIN’s preferred AI partner with AWS and HUMAIN collaborating to ...
-Rimini Street, Inc. (Nasdaq: RMNI), a global provider of end-to-end enterprise software support, managed services and Agentic AI ERP innovation solutions, and the leading third-party support provider for Oracle, SAP and VMware software, announced Silicon Labs has selected Rimini Street as its strategic partner to maximize the value of its SAP ECC 6.0 investment. This collaboration provides the ...
Acquisition strengthens Onto’s position in advanced materials characterization for advanced logic/memory, specialty and advanced packaging segments Onto Innovation Inc. announced the successful closing of its previously announced acquisition of key product lines from the materials analysis business of Semilab International. Valued at approximately $495 million, the transaction ...
Dell AI Factory with NVIDIA advancements accelerate deployment of AI applications, from traditional to agentic, creating integrated, efficient IT environments Dell ObjectScale and PowerScale, the Dell AI Data Platform’s storage engines, accelerate workflows for AI applications and high performance compute with NVIDIA Dynamo integration Dell Automation Platform expansion offers automate...
Galbot is proud to announce two major technological advancements in embodied intelligence: DexNDM, a neural dynamics model designed to revolutionize robotic dexterous manipulation, and NavFoM, the world's first cross-embodiment, cross-task navigation foundation model. Developed in collaboration with Tsinghua University, Peking University, University of Adelaide, and Zhejiang University, these in...
Targeting edge LLM applications, accelerating edge AI ecosystem development VeriSilicon (688521.SH) recently announced the joint launch of the Coral NPU IP with Google, targeting always-on, ultra-low-energy edge Large Language Model (LLM) applications. The IP is based on Google’s foundational research in open machine learning compilers and enhanced with AI security features, pro...
Fabric8Labs, the company pioneering Electrochemical Additive Manufacturing, announced a $50 million funding round to expand its U.S.-based advanced manufacturing facilities, boosting capacity to produce tens of millions of components annually. Powered by its breakthrough Electrochemical Additive Manufacturing (ECAM) technology, Fabric8Labs is scaling up production of next-generation electronic...
Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, announced that it has delivered the industry’s first sixth-generation Registered Clock Driver (RCD) for DDR5 Registered Dual In-line Memory Modules (RDIMMs). The new RCD is the first to achieve a data rate of 9600 Mega Transfers Per Second (MT/s), surpassing the industry standard. This brea...
New Framework outlines OIF’s vision for 448 Gbps interconnects, setting the stage for future Implementation Agreements that will power AI, HPC and communications systems OIF convened its Q4 2025 Technical and MA&E Committees Meeting in Busan, South Korea, Nov. 3–7, where global members gathered to advance the organization’s work across optical, electrical, manage...