Magnachip Semiconductor Corporation (NYSE: MX) (“Magnachip” or the “Company”) announced it has concluded an agreement with Hyundai Mobis Company Limited (hereinafter “MOBIS”) regarding the use of high-performance Insulated Gate Bipolar Transistor (IGBT) technology, and plans to expand its business based on this technology. Hyundai Mobis is a global auto ...
Nvidia Corporation has entered into a landmark agreement with several of South Korea’s largest technology and manufacturing companies to co-develop and supply AI-optimised semiconductor systems, signalling an accelerated regional expansion for the world’s leading AI-chipmaker. The partnership underscores Nvidia’s strategic intent to anchor itself more firmly in the Asi...
South Korea’s exports surged to approximately US $59 billion in October, marking the fifth straight month of growthas demand for semiconductors continues to anchor the nation’s trade performance. According to data released by the Ministry of Trade, Industry and Energy, outbound shipments rose by 3.6 per cent year-on-year, underscoring the resilience of Korea’s technology secto...
The United States has declared a sweeping tariff policy envisaging a 100 % duty on imported semiconductor chips, with exemptions available for companies manufacturing or committing to manufacture within U.S. borders. The announcement reflects broader efforts to revitalise domestic chip production and reduce dependence on foreign fabrication. Firms that demonstrate genuine U.S. production commit...
Magnachip Semiconductor Corporation announced the release of two new 650V Super Junction MOSFET (SJ MOSFET) products, adopting the TO-Leadless (TOLL) package, that are designed to meet the high-power and high-current requirements of premium consumer electronics such as premium TVs, gaming monitors, AI laptop adaptors, and chargers. Current Magnachip products with TOLL packaging, such as the 80V...
The company presented the 'AIN Family' which consists of NAND solution products optimized for performance(P), bandwidth(B), and density(D) respectively for AI SK hynix held 'HBF Night' to expand the 'AIN B'(HBF product) ecosystem with a number of global big tech officials in attendance Company will collaborate closely with customers and partners to become a key player in the next generation...
Jensen Huang, the chief executive of NVIDIA, is scheduled to participate in the upcoming Asia-Pacific Economic Cooperation (APEC) CEO Summit in South Korea, which runs from October 28 to 31. NVIDIA said Huang will engage with global heads of state and senior Korean executives, including representatives of giants such as Samsung Electronics and SK Hynix. In a statement, the compa...
The family of Samsung Chairman Jay Y. Lee—including his mother, Hong Ra‑hee, and sisters Lee Boo‑jin and Lee Seo‑hyun—is preparing to sell approximately 17.7 million shares in Samsung Electronics, representing about a 0.3 % stake and valued at roughly 1.73 trillion won (≈ US$1.22 billion). The sale, to be conducted via a trust arrangement through Shinhan ...
OpenAI announced a series of strategic partnerships with South Korean technology leaders Samsung and SK Group to accelerate the development of Stargate, a landmark $500 billion initiative aimed at building next-generation infrastructure for artificial intelligence. The announcements followed a meeting in Seoul between OpenAI CEO Sam Altman, South Korean President Lee Jae Myung, and senior execu...
Aiming to strengthen the private-sector-led domestic automotive semiconductor ecosystem, expanding interdisciplinary cooperation across foundries, fabless companies, packaging companies, and more The company hosted the inaugural Auto Semicon Korea with the goal to localize automotive semiconductors and create a self-sustaining domestic value chain and business opportuniti...
SK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor packaging technology based on 8-inch wafers – in collaboration with LB Semicon. This achievement marks a significant step forward in advancing next-generation semiconductor pa...
LG Innotek has teamed up with Aeva, an American company specializing in LiDAR (Light Detection And Ranging) technology, to preempt the LiDAR market. LG Innotek announced on July 29, 2025, the signing of a strategic partnership outlining the strategic supply and joint development of next-generation LiDAR technology. Aeva developed the world's first 4D LiDAR based on the frequency modulate...
Rebellions Inc., a leading AI semiconductor company based in South Korea, announced a collaboration with Marvell Technology, Inc. to offer high-performance, energy-efficient AI systems tailored for regionally driven and sovereign-backed AI initiatives across APAC and the Middle East. As AI infrastructure becomes increasingly central to national competitiveness, a shift is underway from sta...
Hyundai Mobis has obtained the highest grade of ISO 26262 certification, an international standard for functional safety, for its entire vehicle semiconductor R&D process. It is noted that this rigorous certification was obtained not for specific products, but for the entire process ranging from semiconductor design to quality verification. This certification means that when Hyundai M...
SK hynix Inc. (or 'the company', www.skhynix.com) announced that it has completed development of its 321-layer 2Tb QLC NAND flash product and has begun mass production. This achievement marks the world's first implementation of more than 300 layers using QLC technology, setting a new benchmark in NAND density. The company plans to release the product in the first half of next year foll...
LG Innotek recently held an event to unveil its newly developed 'Next-generation Digital Key Solution' for the first time to the media. The 'Next-generation Digital Key Solution' is a flagship product of LG Innotek's automotive connectivity business, a key pillar of its automotive components business, along with 5G communication modules and automotive AP modules. The digital key is touted as a...
Valens Semiconductor announced that Samsung is supporting the MIPI A-PHY standard for high-speed sensor connectivity and is partnering with Valens Semiconductor to develop the next generation of MIPI A-PHY products, in response to strong market demand from global OEMs. Valens and Samsung have a long history of collaboration. Samsung was among the earlier investors in Valens, and the two co...
DB HiTek, a leading 8-inch specialty foundry, announced it is in the final stages of development of its 650V E-Mode GaN HEMT (Gallium Nitride High-Electron Mobility Transistor) process, a next-generation power semiconductor platform. The company is also to offer a dedicated GaN MPW (multi-project wafer) program at the end of October. Compared with traditional silicon-ba...
SK hynix Inc. (or "the company", www.skhynix.com) announced that it has completed development and finished preparation of HBM4*, a next generation memory product for ultra-high performance AI, mass production for the world's first time. SK hynix said that the company has successfully completed development and based on this technological achievement, the company has prepared HBM4 mass production t...
OPROCESSOR INC, incorporated in Boston, Massachusetts in 2018 with research operations in Daejeon, South Korea, announced a breakthrough in VCSEL-based Photonic Interposer technology that overcomes the GPU–HBM interconnect bottleneck for next-generation AI and high-performance computing systems. The pioneering work was published in Photonics (MDPI, August 29, 2025) and will be presented a...