• Monday | 10 August 2026
3M Joins JOINT3 Consortium to Advance Next-Generation Semiconductor Packaging

3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, equipment and design.  JOINT3 is a co-creation evaluation platform established by Japan-based Resonac Corporation with the aim of accelerating the development of tools optimized for panel-level organic interposers, the thin layers made from org...

2 Oct 2025 | Thursday | NEWS
GS Microelectronics Acquires Muse Semiconductor to Expand Global MPW Services and Innovation Reach

GS Microelectronics US, Inc. (GSME), a leading-edge global supplier of integrated circuit design and manufacturing solutions, announced that it has acquired Muse Semiconductor. Muse Semiconductor is a recognized provider of multi-project wafer (MPW) services, enabling chip designs built on TSMC technology. This strategic acquisition will expand GSME's reach into key innovation hubs across No...

2 Oct 2025 | Thursday | NEWS
Sony Unveils IMX775: Industry’s Smallest 2.1 µm Pixel RGB-IR Image Sensor for In-Cabin Monitoring

Sony Semiconductor Solutions Corporation (Sony)  announced the upcoming release of the IMX775 CMOS RGB-IR image sensor with the industry's smallest[*1] pixel size of 2.1 µm, delivering both RGB and IR imaging on a single chip and a resolution of approximately 5 effective megapixels,[*2] designed for in-cabin monitoring cameras. *1  Among CMOS image sensor...

2 Oct 2025 | Thursday | NEWS

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